Fatigue behaviors of C/Mo double-coated SiC fiber-reinforced Ti6Al4V composites with varied interfacial microstructure

X, Luo; Ji, Xiaonan; Yang, Yanqing; Feng, Guanghui; Li, C.; Bin, Huang

doi:10.1080/09276440.2015.1060749

Cited by 3 publications

(2 citation statements)

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“…In addition, as the linear expansion coefficient of Ni is between Mo and Cu, Ni solves the interface stress problem. [ 81–83 ] Therefore, Zhang et al [ 59 ] proposed to use Ni as the interlayer to bond Mo and Cu, and compared the tensile strength of Mo/Ni/Cu and Mo/Cu interfaces at different bonding temperatures and durations. The higher the temperature, the higher the contact rate, the faster the atomic diffusion, the larger the interface deformation, and the better the bonding effect.…”

Section: Interface Bonding and Bonding Mechanismsmentioning

confidence: 99%

“…The addition of activated element Ni reduced the TC of Mo–18Cu composites, while the resistivity increased. [ 82 ] The lower conductivity of Cu–20Cr (Mo) is due to the greater refinement of the Cu matrix, as it is filled with fine hard Cr (Mo) particles, compared to Cr and Mo metal powders alone. The higher conductivity of Cu–10Cr–10Mo was due to the coarsening of grains, which reduced the total number of grain boundaries.…”

Section: Thermal Conductivity Modelsmentioning

confidence: 99%

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Strengthening Mechanisms and Thermal Models of Chemically Incompatible Metals (Mo/W–Cu): A Review

et al. 2023

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Molybdenum (Mo) and tungsten (W) are elements of the same family with similar properties, and both of them have high hardness, mechanical strength, and electrochemical corrosion properties, [1] which are widely used in the research and application of hightemperature and arc ablation-resistant materials. [2,3] Mo-Cu and W-Cu alloys are typical pseudoalloys. [4] There is almost no reaction between tungsten and copper, molybdenum and copper in the sintering process, and almost no intermetallic compounds are produced, which is due to the great differences in crystal structure and physical properties between tungsten and copper particles, molybdenum and copper particles. [5,6] W-Cu alloys and Mo-Cu alloys are widely used in microelectronics applications, aerospace technology, and military equipment because of their excellent electrical conductivity, excellent thermal conductivity, excellent arc resistance, flame retardant of fused joints, and other attractive properties. [1,[7][8][9] The addition of Cu and other high thermal conductivity (TC) metals can make it have a thermal expansion coefficient (CTE) close to silicon and high TC. [7][8][9][10][11][12][13] When the service temperature exceeds the melting point of Cu, Cu in the material can absorb a lot of heat through the transformation of physical states such as liquefaction and evaporation, and play a role of sweating and cooling. [9] As a result, Mo/W-Cu composites (Mo-Cu and W-Cu) have excellent high-temperature resistance and better ablation resistance than pure metal Mo/W. [14][15][16][17] Mo/W-Cu composites have excellent physical and mechanical properties, but their applications are severely limited by density and interface problems. Densification and interface strengthening can improve mechanical, thermal, and electrical properties of Mo/W-Cu composites. The electrical and thermal properties of Mo/W-Cu composites are closely related to the addition of alloying elements, [6] densification of green compacts, [18,19] thermal cycle, [20] and applied pressure in the case of hot pressing. [21] At present, the study in the densification of Mo/W-Cu composites is almost about the influence of a single factor, and there is no comprehensive summary of the densification process. In the experimental process, there are also considerable difficulties in fully characterizing the microstructure, atomic structure, and chemical properties of the interface, which can be described by creating molecular dynamics models. However, there are few researches on molecular dynamics simulation of Mo/W-Cu composite.Mo/W-Cu composites are an attractive radiator material due to their combinational properties of Mo/W and Cu. [22] However, Mo/W-Cu composites materials are widely distributed in

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Section: Interface Bonding and Bonding Mechanismsmentioning

confidence: 99%

Section: Thermal Conductivity Modelsmentioning

confidence: 99%