2019
DOI: 10.1016/j.sna.2019.02.020
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Fast packaging by a partially-crosslinked SU-8 adhesive tape for microfluidic sensors and actuators

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Cited by 20 publications
(8 citation statements)
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“…Electrode materials such as aluminum, copper, titanium, and steel are commonly corroded by corona [72,73]. Noll et al performed ionization tests using germanium and silicon needles to overcome corrosion effects [74].…”
Section: Yearmentioning
confidence: 99%
“…Electrode materials such as aluminum, copper, titanium, and steel are commonly corroded by corona [72,73]. Noll et al performed ionization tests using germanium and silicon needles to overcome corrosion effects [74].…”
Section: Yearmentioning
confidence: 99%
“…Polymers are attracting widespread interest for use in medical devices because of their high chemical resistance, biocompatibility, and optical transparency and low cost (lower than that of glass or silicon). Various polymeric materials, such as photoresist (model:SU-8) [1], poly(dimethyl)siloxane [2], polyimide [3], and poly-(para-chloro-xylylene) (Parylene C), have been investigated as packaging materials in many applications, including consumer electronics, lab-on-a-chip analysis, and prosthetic devices [4].…”
Section: Introductionmentioning
confidence: 99%
“…The high thermal stability of polyamide plastics derives from their strong hydrogen bonding between the chain and the crystal structure allowing their application in a high temperature environment. Polyamides are additionally also widely used as membrane materials, 5–8 modifiers for some resins, 9–11 composites, 12 metal organic frameworks for expansion and functionalization, 13,14 and can also be possibly used as adhesives 15 …”
Section: Introductionmentioning
confidence: 99%
“…Polyamides are additionally also widely used as membrane materials, [5][6][7][8] modifiers for some resins, [9][10][11] composites, 12 metal organic frameworks for expansion and functionalization, 13,14 and can also be possibly used as adhesives. 15 The more usual application of polyamides adhesive is used as hot melt adhesives, for the traditional polyamides are mostly thermoplastics of low crystallinity and present a wide range of melting temperatures. [16][17][18] They are thus heated into a viscous fluid before application and spread on the surfaces of the bonded objects.…”
Section: Introductionmentioning
confidence: 99%