Fan-out technologies for WiFi SiP module packaging and electrical performance simulation

Hsieh, Chueh An; Tsai, Chung Hsuan; Lee, Huan Wun; Lee, Tony Yc; Chang, Hui-Ling

doi:10.1109/ectc.2015.7159820

Cited by 9 publications

(1 citation statement)

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“…Tang used the FEM model to simulate the thermal stress distribution in the stacked die of a four-tier die-stacked SiP during thermal cycling, and the Taguchi method was used for optimal design [79]. Hsieh conducted a simulation on RF impedance matching, power integrity, and thermal distribution with a complete Wi-Fi SiP module [80]. Figure 22 shows the result.…”

Section: Current Status Of Reliability Research On Multi-field Coupli...mentioning

confidence: 99%

Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review

Wang,

Liu,

Huo

et al. 2024

Micromachines

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With the advancement of Moore’s Law reaching its limits, advanced packaging technologies represented by Flip Chip (FC), Wafer-Level Packaging (WLP), System in Package (SiP), and 3D packaging have received significant attention. While advanced packaging has made breakthroughs in achieving high performance, miniaturization, and low cost, the smaller thermal space and higher power density have created complex physical fields such as electricity, heat, and stress. The packaging interconnects responsible for electrical transmission are prone to serious reliability issues, leading to the device’s failure. Therefore, conducting multi-field coupling research on the reliability of advanced packaging interconnects is necessary. The development of packaging and the characteristics of advanced packaging are reviewed. The reliability issues of advanced packaging under thermal, electrical, and electromagnetic fields are discussed, as well as the methods and current research of multi-field coupling in advanced packaging. Finally, the prospect of the multi-field coupling reliability of advanced packaging is summarized to provide references for the reliability research of advanced packaging.

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Section: Current Status Of Reliability Research On Multi-field Coupli...mentioning

confidence: 99%