Failure of electronic devices due to condensation

Schimpf, C.; Feldmann, Klaus; Matzner, C.; Steinke, Arndt

doi:10.1007/s00542-008-0643-y

Cited by 15 publications

(9 citation statements)

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“…It has also been 9 Effect of potential bias on a probability of ECM and b dendrite current reported that the threshold electric field under which the ECM will not occur is below 1 mV mm 21 . 4 An increase in electric field widens the precipitation of tin hydroxide, and also promotes the formation of dendrites (Fig. 10b).…”

Section: Effect Of Electric Field On Electrochemical Migrationmentioning

confidence: 99%

“…At high chloride levels the probability of migration also slightly reduces due to the large amounts of dissolved tin ions in the solution which leads to heavy precipitation reducing the migration rate as reported in literature. 15,22 The precipitated species can be hydroxides of tin namely Sn(OH) 4 and/or -Sn(OH) 2 , although intermediate hydroxyl chloride species are also possible. 23 Optical micrographs of representative tested components with flux residue (Fig.…”

Section: Effect Of Sodium Chloride and Flux Residue On Electrochemicamentioning

confidence: 99%

“…As the potential bias increases due to the dissolution of large amounts of tin ions, the alkaline boundary for the formation of (Sn(OH) 6 ) 22 becomes unsustainable as reported by Minzari et al 15 It is known that tin can be oxidized to state z2 or z4 and form stannic compounds or be passivated if the appropriate conditions are established. 25 If the stannous or stannic ions are formed, they will be rapidly hydrolysed as various tin hydroxides through intermediate species, where Sn(OH) 4 is dominant. 15,25,29 The tin hydroxides will move towards the cathode and will experience the pH change from acidic at the anode to alkaline at the cathode.…”

Section: Effect Of Electric Field On Electrochemical Migrationmentioning

confidence: 99%

See 2 more Smart Citations

Influence of sodium chloride and weak organic acids (flux residues) on electrochemical migration of tin on surface mount chip components

Verdingovas

Jellesen

Ambat

2013

Corrosion Engineering, Science and Technology

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The electrolytic properties of sodium chloride and no-clean solder flux residue, and their effects on electrochemical migration and dendrite growth on surface mount chip capacitors were investigated. The leakage current dependency on concentration of contaminants was measured by a solution conductivity method and compared with current measurements using DC voltage. The effect of electrolyte concentration and potential bias on the probability of electrochemical migration was investigated using a water droplet method on chip capacitors. The results from leakage current and conductivity measurement showed a difference which is caused by polarization effects, and demonstrated existing issues when indexing contamination levels on printed circuit board assemblies using a standardised solvent extract method. The experimental results showed that dendrite growth was dependent on the type and amount of contamination. The probability of migration becomes less dependent on the amount of contamination for sodium chloride at high concentrations. However, for organic acids from flux residues the migration probability shows an abrupt decrease with increasing concentration, which is attributed to a pH change in the condensed electrolyte phase.

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Section: Effect Of Electric Field On Electrochemical Migrationmentioning

confidence: 99%

Section: Effect Of Sodium Chloride and Flux Residue On Electrochemicamentioning

confidence: 99%

Section: Effect Of Electric Field On Electrochemical Migrationmentioning

confidence: 99%

See 1 more Smart Citation

Influence of sodium chloride and weak organic acids (flux residues) on electrochemical migration of tin on surface mount chip components

Verdingovas

Jellesen

Ambat

2013

Corrosion Engineering, Science and Technology

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“…The lifetime and reliability of the electronic devices are important both for the device functionalities and the environmental control. The water intervention to the electronic devices is an important aspect for maintaining and enhancing the device performance 1 , 2 because this type of phenomenon can usually lead to a series of safety issues, sometimes even catastrophes. As silicon is the cornerstone for electronic devices, the performance of most of the electronic devices can be deteriorated by the moisture/steam/ice on silicon inevitably in many scenarios even with the device insulation in place, thus causing short-circuiting, reduced sensitivity or even failure of sensors, such as those used in high-temperature production environments or polar developments.…”

Section: Introductionmentioning

confidence: 99%

Density-functional-theory simulations of the water and ice adhesion on silicene quantum dots

Duan

Choy

2022

Sci Rep

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The absorption of water and ice on silicon is important to understand for many applications and safety concerns for electronic devices as most of them are fabricated using silicon. Meanwhile, recently silicene nanostructures have attracted much attention due to their potential applications in electronic devices such as gas or humidity sensors. However, for the moment, the theoretical study of the interaction between water molecules and silicene nanostructures is still rare although there is already theoretical work on the effect of water molecules on the silicene periodic structure. The specific conditions such as the finite size effect, the edge saturation of the silicene nanostructure, and the distance between the water/ice and the silicene at the initial onset of the contact have not been carefully considered before. Here we have modelled the absorption of a water molecule and a square ice on the silicene nanodot by using hybrid-exchange density-functional theory, complemented by the Van der Waals forces correction. Three different sizes of silicene nanodots have been chosen for simulations, namely $$3\times 3$$ 3 × 3 , $$4\times 4$$ 4 × 4 , and $$5\times 5$$ 5 × 5 , with and without the hydrogen saturation on the edge. Our calculations suggest that the silicene nanodots chosen here are both hydrophilic and ice-philic. The water molecule and the square ice have tilted angles towards the silicene nanodot plane at ~ 70º and ~ 45º, respectively, which could be owing to the zig–zag structure on silicene. The absorption energies are size dependent for unsaturated silicene nanodots, whereas almost size independent for the hydrogen saturated cases. Our work on the single water molecule absorption energy on silicene nanodots is qualitatively in agreement with the previous theoretical and experimental work. However, the ice structure on silicene is yet to be validated by the relevant experiments. Our calculation results not only further complement the current paucity of water-to-silicene-nanostructure contact mechanisms, but also lead to the first study of square-ice contact mechanisms for silicene. Our findings presented here could be useful for the future design of semiconducting devices based on silicene nanostructures, especially in the humid and low-temperature environments.

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“…This implies the formation of an electrolyte solution and the increase in the conductivity of the moisture film on the PCBA surface. As a consequence, the resulting increase in LC can compromise the function of electronic devices [9].…”

Section: Introductionmentioning

confidence: 99%

On the Effects of Atmospheric Particles Contamination and Humidity on Tin Corrosion

D'Angelo

Verdingovas

Ferrero

et al. 2017

IEEE Trans. Device Mater. Relib.

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Abstract-The effects of hygroscopic atmospheric particles are investigated in relation with corrosion of tin. Surface insulation resistance test boards were directly contaminated both with ambient particles sampled in the field at Milan (Italy) and with pure saline particles generated in the laboratory. An innovative particle deposition device was used to uniformly coat circular spots on to the test board surfaces. Deliquescence and crystallization of the water-soluble compounds were detected by observing the impedance response to varying relative humidity (RH) conditions with a gradual and continuous ramps. The effects of the adsorption/desorption kinetics and of the temperature on the deliquescence and crystallization relative humidity values were also investigated. Leakage current measurements at 5 V DC highlighted the ability of atmospheric particles to promote corrosion and electrochemical migration at RH levels far below condensing conditions (100% RH).

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Failure of electronic devices due to condensation

Cited by 15 publications

References 0 publications

Influence of sodium chloride and weak organic acids (flux residues) on electrochemical migration of tin on surface mount chip components

Influence of sodium chloride and weak organic acids (flux residues) on electrochemical migration of tin on surface mount chip components

Density-functional-theory simulations of the water and ice adhesion on silicene quantum dots

On the Effects of Atmospheric Particles Contamination and Humidity on Tin Corrosion

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