Failure Modes in Adhesively Bonded Carton Boards

Korin, Christer; Hallbäck, Nils; Junghans, R.

doi:10.1163/156856108x338466

Cited by 4 publications

(7 citation statements)

References 13 publications

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“…Previous studies indicate that delamination takes place either by fibre tear in the outermost ply, adjacent to the adhesive, or by ply tearing of the outermost ply from the middle ply. Guided by this observation, the carton board model employed in this study was built up according to Figure .…”

Section: Methodsmentioning

confidence: 88%

“…The mechanical strength of adhesive joints in carton board packages has been measured with a Y-peel method described by Tryding et al 2 , and the dissipative energy has been used 3 in order to quantify the fracture performance. In earlier work 4 , four main failure modes have been identified. It was found that the energy dissipated at fracture critically depends on whether the fracture occurs predominantly in the carton board or at the interface between the carton board and the HMA.…”

Section: Introductionmentioning

confidence: 99%

“…It was found that the energy dissipated at fracture critically depends on whether the fracture occurs predominantly in the carton board or at the interface between the carton board and the HMA. Fracture in the carton board is characterized by delamination and fibre tear , whereas interfacial fracture involves breaking up chemical interactions and mechanical interlocking of the mating surfaces. All these earlier works have been mostly experimental, and a large number of Y‐peel tests have been made.…”

Section: Introductionmentioning

confidence: 99%

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Finite Element Analysis of Hot Melt Adhesive Joints in Carton Board

Hallbäck

Korin

Barbier

et al. 2014

Packag. Technol. Sci.

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The mechanical behaviour of adhesive joints is critical for the performance of adhesively joined carton board packages. In this work, finite element analyses of hot melt adhesive (HMA) joints in carton board is conducted and compared to experimental results obtained using a Y-peel testing device. The aim of the present study is to analyse the behaviour of adhesive joints tested in the Y-peel testing device using a layered carton board model.The carton board is modelled as a layered structure where the layers are assumed to obey Hill's orthotropic elastic-plastic model, and the interfaces are modelled using a softening orthotropic damage model. The HMA is modelled as isotropic linear elastic, and the influence from a varying elastic modulus of the HMA is explored. It is found that the pre-peak behaviour of the Y-peel force-elongation curves is reasonably well captured by the FE simulations, although the initial stiffness is somewhat too high. Also, the pre-peak behaviour is practically insensitive to changes of the elastic modulus of the HMA.The deformation and delamination pattern obtained in the simulations was compared with microscope pictures taken during the corresponding Y-peel experiments, and it is shown that they conform to the observed behaviour during Y-peel testing at comparable loading levels. However, the delamination opening is somewhat underestimated by the model.

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Section: Methodsmentioning

confidence: 88%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Finite Element Analysis of Hot Melt Adhesive Joints in Carton Board

Hallbäck

Korin

Barbier

et al. 2014

Packag. Technol. Sci.

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“…1) from ZR Sverige (Gothenburg, Sweden). The Y-peel tests were made with a tearing speed of 10 mm/min at 50% RH and 23 • C, for more details see Tryding et al [6] and Korin and coworkers [1,14]. Some of the failures were subsequently examined using Scanning Electron Microscopy (SEM).…”

Section: Y-peel Testingmentioning

confidence: 99%

“…The adhesive joint must sustain the different stresses that occur during the total lifetime of the package, due to filling, transportation, storage and consumer handling [1].…”

Section: Introductionmentioning

confidence: 99%

Influence of Surface Treatments on the Mechanical Strength of Hotmelt Adhesive Joints Made of Cartonboards

Korin¹,

Seppänen²,

Vähä-Nissi

et al. 2012

Journal of Adhesion Science and Technology

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The influence of surface treatments including pigment coating, surface sizing and calendering on the mechanical strength of hotmelt adhesive joints in pilot made cartonboards was studied. The mechanical strength of the joints was investigated using the Y-peel test device at 23 • C and 50% relative humidity. Some of the samples were investigated with respect to the failure mode by scanning electron microscopy. The surfaces were characterized in terms of surface roughness, surface chemical composition, and adhesion behaviour. A strong adhesive bond displayed fibre tear. In addition to fibre tear, interfacial failure, i.e., failure between the cartonboard and the adhesive, was the main reason for fracture in the bonded assembly. The most important factor controlling the integrity of adhesive joints seemed to be the real contact area. The adhesive joints showed significantly higher strength when the hotmelt adhesive was first applied onto the rougher cartonboard of the assembly and then the smoother cartonboard was pressed on the adhesive than vice versa. The surface roughness of cartonboards mainly depended on whether the surface was pigment coated or not. Calendering displayed only a minor effect. No clear influence of surface chemical composition of the cartonboards on the adhesive joint strength was found due to the fact that changes in surface chemistry in this study also led to changes in surface roughness. The strongest adhesive joint was created between two medium-rough and surface-sized cartonboards.

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An ultra‐low cost line follower robot as educational tool for teaching programming and circuit's foundations

Pérez

López

2018

Comp Applic In Engineering

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In this paper, an ultra low‐cost line following robot is presented. The robot is developed through the integration of free educational software and low cost electronics and mechanical devices with the aim of been used as a teaching and learning tool to increase the students confidence/performance and interest in engineering areas. The cost for building this robot‐based educational tool and its related activities is less than 25 USD. Students were encouraged for building its own unique designs using cardboard and open‐source software and hardware. The activities promoted the increase in knowledge and developed student's technical skills such as the use of electronic circuits and sensors, three dimension designs, learning to programming animations and microcontrollers, building self‐made structural and mechanical elements using cardboard and the use of the Bluetooth protocol to achieve the interconnection of devices through the use of an Android based Smartphone. The activities have been developed to allow students to apply and test their own ideas and concepts for solving problems through the computational thinking process and finding digital solutions through programming microcontrollers, all of them in the frame of the maker movement and the inclusion of the arts in the science, technology, engineering and mathematics (STEM) education. The results of confidence/performance and interest evaluation tests allowed to identify the main areas of gain knowledge and the increasing interest in the engineering fields presented in this work.

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Failure Modes in Adhesively Bonded Carton Boards

Cited by 4 publications

References 13 publications

Finite Element Analysis of Hot Melt Adhesive Joints in Carton Board

Finite Element Analysis of Hot Melt Adhesive Joints in Carton Board

Influence of Surface Treatments on the Mechanical Strength of Hotmelt Adhesive Joints Made of Cartonboards

An ultra‐low cost line follower robot as educational tool for teaching programming and circuit's foundations

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