Failure Mechanisms of Electronic Components

Church, H. F.; Roberts, Bruce C.

doi:10.1109/irps.1965.362319

Cited by 2 publications

(1 citation statement)

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“…Although there are various failure mechanisms due to corrosion caused [10][11][12][13] by humidity and ionic contaminations on the PCBA surface and electronic components, leak current and failures due to dendrite formation by ECM has special significance due to the possibility of intermittent failures when transient condensing conditions exists during application. Therefore, vast majority of failures are due to the corrosion failure mechanisms caused by the water film formation on the PCBA surface as a result of the device exposure to the climatic conditions, which is induced by the electrochemical processes between the biased points on the PCBA surface.…”

Section: Introductionmentioning

confidence: 99%

Investigation of critical factors effect to predict leakage current and time to failure due to ECM on PCB under humidity

Bahrebar

Ambat

2021

Microelectronics Reliability

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Experiments using the Design of Experiment (DoE) methodology were carried out to investigate the effects of pitch distance (P), temperature (T), voltage (V), and contamination (C) on the leak current measured on surface insulation resistance (SIR) test boards. A 2 4 full factorial design with eight replications was performed, and the response was measured continuously over a 20 hour period for each experiment. Current measured over time exhibited a clear pattern of an initial low and stable current, followed by a transition to a much higher current. Microscopic analysis of the boards indicates that the transition is due to dendrite formation due to electrochemical migration (ECM). The time at the start of this transition phase was identified as the time to failure (TTF) for each experiment. Leakage current (LC) was also calculated as the mean current prior to failure. Analysis of Variance methods were used to model both TTF and LC. Both TTF and LC were found to be significantly affected by P, T, and C. However, the effect of V was found to be significant only for TTF. The general current behavior over the prolonged experimental period and the resulting statistical models give new insight into the failure process related to ECM.

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Section: Introductionmentioning

confidence: 99%