Facile preparation of a high-quality copper layer on epoxy resin via electroless plating for applications in electromagnetic interference shielding

Abstract

A convenient and low-cost approach to fabricate a high-quality copper layer on epoxy resin via electroless plating for applications in electromagnetic interference (EMI) shielding is introduced in this paper.

Adhesion‐Enhanced Flexible Conductive Metal Patterns on Polyimide Substrate Through Direct Writing Catalysts with Novel Surface‐Modification Electroless Deposition

“…Compared with the above‐mentioned methods, electroless deposition is especially attractive because it does not require expensive fabrication facilities and can be implemented under ambient conditions and a large industrial scale on flexible polymer substrates . More recently, electroless deposition has been commonly used for the fabrication of conductive interconnects, supercapacitors, conductive textile, batteries,,, sensors, and electromagnetic interference shielding materials . In general, electroless deposition typically involves three major steps: (1) surface modification of the substrate, (2) loading of catalyst moieties to the modified substrate surface, and (3) site‐selective metal electroless deposition ,.…”

Developing a Superhydrophobic Absorption-Dominated Electromagnetic Shielding Material by Building Clustered Fe3O4 Nanoparticles on the Copper-Coated Cellulose Paper

“…3,4 To reduce the harm caused by electromagnetic wave pollution, various electromagnetic interference (EMI) shielding materials have been developed. 5−8 Traditional electromagnetic shielding materials include metal-based materials, 9 conductive filler-filled polymer materials, 10 and composite foam materials. The high conductivity of metalbased materials endows them with excellent electromagnetic shielding performance, but poor processability, high density, and easy corrosivity limit their applications.…”

“…The development and prosperity of science and technology have promoted the progress of communication technology, , which has provided convenience in our lives, but the accompanying electromagnetic wave pollution endangers human health and also affects the stable operation of precision instruments. , To reduce the harm caused by electromagnetic wave pollution, various electromagnetic interference (EMI) shielding materials have been developed. − Traditional electromagnetic shielding materials include metal-based materials, conductive filler-filled polymer materials, and composite foam materials. The high conductivity of metal-based materials endows them with excellent electromagnetic shielding performance, but poor processability, high density, and easy corrosivity limit their applications.…”

High-performance aramid fabric in infrared shielding by magnetron sputtering method

“…At present, the main plating methods for soft substrate textile and clothing fabrics include electroless plating, vacuum evaporation and magnetron sputtering [5,6]. Electroless plating is generally limited in many applications because of its high contamination rates [7]. Vacuum evaporation plating is relatively simple, but it is ineffecient and has poor adhesion of the substrate [8].…”