Fabrication of Three-Dimensional Microstructure Film by Ni-Cu Alloy Electrodeposition for Joining Dissimilar Materials

Kobayashi, Tatsuya; Shohji, Ikuo

doi:10.4028/www.scientific.net/msf.1016.738

Cited by 4 publications

(3 citation statements)

References 18 publications

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“…Automobile bodies, in particular, are used in extremely severe corrosive environments such as snow-melting and salt spray areas, and thus have strict requirements for corrosion resistance [5][6][7][8]. To solve this problem, dissimilar material joining using electroplating film was investigated [9][10][11]. Joining by a three-dimensional plating film with microscopic irregularities prevents direct contact between the metal and carbon fibers.…”

Section: Introductionmentioning

confidence: 99%

Effect of Special Plating Films on Galvanic Corrosion Behavior between Metal and CFRTP

Kobayashi,

Shimizu,

Shohji

2023

MSF

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In this study, electrochemical measurements and observations investigated galvanic corrosion behavior between various metals with or without projection-shaped Ni–Cu alloy plating film and carbon-fiber-reinforced thermoplastic (CFRTP) of corroded areas. Stainless steel, aluminum alloy, and CFRTP plates were prepared. Ni and Ni–Cu alloy electroplating were performed on the stainless steel plate. Electroless zinc plating, Ni, and Ni–Cu alloy electroplating were performed on the aluminum alloy plate. The galvanic current between the metal and CFRTP plates was measured using an electrochemical measurement system. The test solution was 0.06 mol/L NaCl aqueous solution. For Stainless steel/CFRTP, the galvanic current flow was negligible with and without the Ni–Cu alloy plating film. For aluminum alloy/CFRTP without the Ni–Cu alloy plating film, the galvanic current ranged from-80 to-120 μA/cm2 at a test temperature of 60°C. For aluminum alloy with the Ni–Cu alloy plating film, the galvanic current ranged from-60 to-80 μA/cm2. The galvanic current for the aluminum alloy plate with Ni–Cu alloy plating was lower than that of the aluminum alloy plate without Ni–Cu alloy plating film. The result suggests that the formation of the Ni–Cu alloy plating on the aluminum alloy improves corrosion resistance.

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Section: Introductionmentioning

confidence: 99%

Effect of Special Plating Films on Galvanic Corrosion Behavior between Metal and CFRTP

Kobayashi,

Shimizu,

Shohji

2023

MSF

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“…The Ni plating has excellent corrosion resistance and diffusion resistance [4]. Ni-Cu alloy plating combining these metals can form a three-dimensional structural plating film with fine irregularities under certain conditions without the use of photoresists for plating [5][6][7]. By forming this plating film on the wiring layer and lead frame, adhesion between the plating film and semiconductor encapsulating resin can be expected to improve through the anchoring effect [8].…”

Section: Introductionmentioning

confidence: 99%

Effect of Plating Potential on Three-Dimensional Structural Plating Films and their Adhesion to Epoxy Resin

Kobayashi,

Pham,

Shohji

2023

KEM

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This study investigated the electrochemical behavior of Ni–Cu alloy plating baths during plating and dealloying reactions. Furthermore, the potential and plating time effects on the shape of three-dimensional structural Ni–Cu alloy plating film and its adhesion to epoxy resin were investigated. Nodules were observed on the surface of the plating film generated at potentials from-0.5 V to-1.0 V. When the plating films formed at potentials of-1.0 V to-1.5 V were dealloyed, the formation of pores was observed. The shear test results showed that the average shear strength of the specimen joined with epoxy resin between two Cu plates with Ni–Cu alloy plating film formed at a potential of-1.0 V was the highest under all conditions.

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“…Robust and compact structures are the key characteristics demanded for all modern engineering products [ 1 , 2 , 3 , 4 ]. The realization of both robustness and compactness in a component is possible only if it is made from multiple materials [ 5 , 6 , 7 , 8 , 9 , 10 , 11 ]. Joints of dissimilar materials give different combinations of mechanical and metallurgical characteristics in a product.…”

Section: Introduction—joining Of Copper To Stainless Steel Bimetallic...mentioning

confidence: 99%

The Joining of Copper to Stainless Steel by Solid-State Welding Processes: A Review

et al. 2022

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Joining immiscible materials such as copper and stainless steel together is a significant concern due to distinct mechanical and metallurgical properties across the joint line, such as melting points, the coefficient of linear thermal expansion, and thermal conductivity. The joint properties of copper to stainless steel welds are in great demand for various mechanical components of the international thermonuclear experimental reactor, ultra-high vacuum system, plan wave linear-accelerator or linac structure, and heat exchanger. These dissimilar-metals joints offer excellent flexibility in design and production, leading to a robust structure for many cutting-edge applications. Hence, the present article reviews the copper to stainless steel joining mechanism under different solid-state processing conditions. The present understanding says that defect-free strong joints between the dissimilar metals are systematically possible. Apart from this understanding, the authors have identified and highlighted the gaps in the research exploration to date. Moreover, a sustainable methodology to achieve a desirable weld of copper to stainless steel depends on favorable processing conditions.

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Fabrication of Three-Dimensional Microstructure Film by Ni-Cu Alloy Electrodeposition for Joining Dissimilar Materials

Cited by 4 publications

References 18 publications

Effect of Special Plating Films on Galvanic Corrosion Behavior between Metal and CFRTP

Effect of Special Plating Films on Galvanic Corrosion Behavior between Metal and CFRTP

Effect of Plating Potential on Three-Dimensional Structural Plating Films and their Adhesion to Epoxy Resin

The Joining of Copper to Stainless Steel by Solid-State Welding Processes: A Review

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