2010
DOI: 10.1016/j.mee.2009.11.078
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Fabrication of surface plasmon waveguides and integrated components on Cytop

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Cited by 27 publications
(28 citation statements)
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“…Advantages of polymers include ease of fabrication and (potentially) low cost. Recent work has focused on developing metal stripe waveguides and structures on [16,17] or embedded in [18] Cytop. Cytop is an amorphous fluoropolymer with a refractive index that is close to that of water (n ∼ 1.334) [19], motivating interest in this material (and in Teflon [20], a similar polymer) for biosensor applications, particularly involving LRSPPs [18,[21][22][23][24].…”
Section: Introductionmentioning
confidence: 99%
“…Advantages of polymers include ease of fabrication and (potentially) low cost. Recent work has focused on developing metal stripe waveguides and structures on [16,17] or embedded in [18] Cytop. Cytop is an amorphous fluoropolymer with a refractive index that is close to that of water (n ∼ 1.334) [19], motivating interest in this material (and in Teflon [20], a similar polymer) for biosensor applications, particularly involving LRSPPs [18,[21][22][23][24].…”
Section: Introductionmentioning
confidence: 99%
“…[16][17][18] The membranes for this structure are $2.5Â thinner than previous Cytop membrane devices, 16 making them significantly more fragile and thus requiring new process steps for their fabrication. [16][17][18] The membranes for this structure are $2.5Â thinner than previous Cytop membrane devices, 16 making them significantly more fragile and thus requiring new process steps for their fabrication.…”
Section: A General Process Considerationsmentioning
confidence: 99%
“…27. One method of bypassing this issue is to overetch the trenches purposely, then deposit the Au layer deep inside the trench; 26 after the resists have been stripped, the exposed Cytop surface could then be etched until it is flush with the metal waveguides with the metal patterns acting as a mask for the Cytop underneath. This is a crucial step because millimeter-thick Cytop edge beads accumulate from multiple layers of spincoating.…”
Section: Fabricationmentioning
confidence: 99%
“…Several surface scans were performed with a KLA Tencor P-10 Stylus Profilometer-a typical result for a Cytop lower cladding bearing Au features in trenches is shown in Fig. 26,27 The large-scale nonuniformity is not expected to prevent bonding because the Cytop layers deform sufficiently during bonding and annealing to fill in the voids; Fig. Ignoring the trenches, the surface profile (topography) varies by $30 nm, which is rather good considering that it occurs over very large areas of the wafer.…”
Section: B Surface and Bond Qualitymentioning
confidence: 99%
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