Fabrication of submicron gratings in fused silica by F 2 -laser ablation

Ihlemann, J.; Müller, Sandra; Puschmann, Stefan; Schäfer, D.; Wei, M.; Li, J.; Herman, Peter R.

doi:10.1007/s00339-002-1467-8

Cited by 64 publications

(20 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…In addition, other researchers came to the conclusion that the grooves' width was material dependent and was closely related to the beam spot size and the beam current density [17]. The cross-sectional profile of the nano-grooves was similar to that reported for nanofeatures milled by FIB on Si and GaAs substrates [21] and also to that of sub-micron gratings produced by F 2 -laser ablation of fused silica [22].…”

Section: Properties Of Nanogrooves Fabricated In Fused Silica With a mentioning

confidence: 62%

A study of fused silica micro/nano patterning by focused-ion-beam

Lalev

Dimov

et al. 2007

Applied Surface Science

View full text Add to dashboard Cite

Section: Properties Of Nanogrooves Fabricated In Fused Silica With a mentioning

confidence: 62%

A study of fused silica micro/nano patterning by focused-ion-beam

Lalev

Dimov

et al. 2007

Applied Surface Science

View full text Add to dashboard Cite

“…Compared with the organic materials, however, the inorganic gratings certainly have some advantages in these aspects. Presently, some processes, such as laser ablation or femtosecond laser ablation, have been proposed, by which inorganic gratings can be fabricated successfully [3,4] . But these processes also have some inevitable disadvantages, such as higher technical difficulty and cost, longer processing duration, and furthermore, the gratings obtained are usually with irregular edges.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of inorganic film gratings and study on their diffraction properties

Wang

Zhao

et al. 2008

Sci. China Ser. E-Technol. Sci.

View full text Add to dashboard Cite

A novel process for fabricating high-density and high diffraction efficiency inorganic gratings has been proposed by combining laser interference and chemical etching. In the present work, UV photosensitive Zr-contained sol was synthesized, and photosensitive ZrO 2 /BzAc gel films on (100) silicon were prepared using the sol-gel method. Subsequently, inorganic film gratings with a pitch of 1 μm were fabricated by laser interference in this photosensitive gel film combining with the process of heat treatment. In order to increase the depth-to-width ratio of the gratings, chemical etching was adopted by using iodine-saturated KOH as anisotropic etchant, which improved the diffraction efficiency of the gratings effectively. Furthermore, the diffraction efficiency was improved by gold coating to enhance the surface glossiness and reflection coefficient.sol-gel, high-density gratings, laser interference, chemical etching, diffraction efficiency

show abstract

“…While ablation at 193 nm is possible at high fluences (in excess of 2 J/cm 2 ) the ablation rate is found to depend on the surface roughness and irradiation by multiple pulses can lead to crack formation [1]. Processing of fused silica at 157 nm (F 2 laser) has been performed by a number of groups and interesting applications have been demonstrated [2][3][4][5]. The experimental effort, however, is very high: beam lines have to be evacuated or purged to remove any absorbing oxygen and laser optics have to be all-reflective or made from expensive materials like calcium fluoride.…”

Section: Introductionmentioning

confidence: 99%

Ablation of silicon suboxide thin layers

Jahn

Richter

Weichenhain-Schriever

et al. 2010

Appl. Phys. A

Self Cite

View full text Add to dashboard Cite

We investigate the ablation of SiO x thin films on fused silica substrates using single-pulse exposures at 193 nm and 248 nm. Two ablation modes are considered: front side (the surface of a film is irradiated from above) and rear side (a film is irradiated through its supporting substrate). Fluence is varied from below 200 mJ/cm 2 to above 3 J/cm 2 . SiO x films of thickness 200 nm, 400 nm, and 600 nm are ablated. In the case of rear-side illumination, at moderate fluences (around 0.5 mJ/cm 2 ) the ablation depth corresponds roughly to the film thickness, above 1 J/cm 2 part of the substrate is ablated as well. In the case of frontside ablation the single-pulse ablation depth is limited for all film thicknesses to less than 200 nm even at fluences up to 4 J/cm 2 . Experimental results are discussed in relation to film thickness, fluence, and ablation mode. Simple numerical calculations are performed to clarify the influence of heat transport on the ablation process.

show abstract

Fabrication of submicron gratings in fused silica by F 2 -laser ablation

Cited by 64 publications

References 0 publications

A study of fused silica micro/nano patterning by focused-ion-beam

A study of fused silica micro/nano patterning by focused-ion-beam

Fabrication of inorganic film gratings and study on their diffraction properties

Ablation of silicon suboxide thin layers

Contact Info

Product

Resources

About