2022
DOI: 10.1109/jsen.2022.3166936
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Fabrication of Silver Electrical Circuits on Textile Substrates by Reactive Inkjet Printing

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Cited by 8 publications
(3 citation statements)
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“…Compared to bulk silver, the printed conductive layer demonstrated a greater conductivity. Different stretch orientations on the knitted textiles were used to assess the resistance variance [110].…”
Section: Drop/dye/dip Coatingmentioning
confidence: 99%
“…Compared to bulk silver, the printed conductive layer demonstrated a greater conductivity. Different stretch orientations on the knitted textiles were used to assess the resistance variance [110].…”
Section: Drop/dye/dip Coatingmentioning
confidence: 99%
“…Therefore, in-textile fabrication and monolithic integration of electronic devices and circuits using commonly adopted conductive materials (e.g., tin and copper) are in high demand (41)(42)(43)(44). Polymer-assisted metal deposition (PAMD), a low-cost and highthroughput technique, has become a practical chemical process for fabricating conductive textiles due to its superior stability and conductivity (45)(46)(47)(48)(49)(50).…”
Section: Introductionmentioning
confidence: 99%
“…[26] This approach has a significant advantage over particle-based colloid inks because the small spherical Ag particles in colloidal inks often clog the dispensing nozzle of the inkjet printer. In contrast, the aqueous solvents of the particle-free silver ink do not restrict the nozzle size and thus enable very small amounts of the solution to be deposited onto different types of substrates, including flexible materials such as paper, [39,40] individual fibers, [41] textiles, [42,43] and plastics. [44,45] Particle-free silver inks have been explored by numerous researchers who investigated chemical reaction design, fabrication of conductive electrode patterns, and a wide variety of applications.…”
Section: Introductionmentioning
confidence: 99%