2008
DOI: 10.1002/smll.200800625
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Fabrication of Silicon Nanopillar Teradot Arrays by Electron‐Beam Patterning for Nanoimprint Molds

Abstract: Critical issues that occur during the fabrication of high‐density nanostructures by e‐beam lithography are considered. A 25‐nm‐pitch Si nanopillar array and a 15‐nm‐pitch resist nanodot array are fabricated. Transfer of 1 teradot inch−2 patterns from the nanopillar array to a polymer surface is carried out by nanoimprint lithography (see picture).

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Cited by 31 publications
(26 citation statements)
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“…Control of nanopatterns has been achieved by different methods, such as the production of nanoimprint masks by exposure of polymers to electron beams and subsequent pattern transfer to films or substrates, 1 or the exploitation of self-organization processes during ion beam irradiation of specific materials resulting in arrays of hexagonally ordered dots 2 or holes. Control of nanopatterns has been achieved by different methods, such as the production of nanoimprint masks by exposure of polymers to electron beams and subsequent pattern transfer to films or substrates, 1 or the exploitation of self-organization processes during ion beam irradiation of specific materials resulting in arrays of hexagonally ordered dots 2 or holes.…”
Section: Introductionmentioning
confidence: 99%
“…Control of nanopatterns has been achieved by different methods, such as the production of nanoimprint masks by exposure of polymers to electron beams and subsequent pattern transfer to films or substrates, 1 or the exploitation of self-organization processes during ion beam irradiation of specific materials resulting in arrays of hexagonally ordered dots 2 or holes. Control of nanopatterns has been achieved by different methods, such as the production of nanoimprint masks by exposure of polymers to electron beams and subsequent pattern transfer to films or substrates, 1 or the exploitation of self-organization processes during ion beam irradiation of specific materials resulting in arrays of hexagonally ordered dots 2 or holes.…”
Section: Introductionmentioning
confidence: 99%
“…E-beam lithography and reactive ion etching (RIE) processes were used to form small nanopores less than 10 nm. The resolution of the top-down drilling method depends on many factors, such as beam scattering [159], resist chemistry [160], and critical dimension loss during pattern transfer [161], which is adverse for fabricating sub-10 nm nanopores. The ALD method was used to shrink the pore size by depositing controllable film on the nanometer scale [157,162].…”
Section: Fabrication Of Nanochannelsmentioning
confidence: 99%
“…12 In the case of electron-beam lithography, the smallest dotpattern pitch size (the highest density of nanodots) reported thus far is approximately 15 nm pitch in a resist and 25 nm pitch in an Si wafer using hydrogen silsesquioxane (HSQ) as a resist material. 13 This number correlates to a density of 1 Tbit/in. 2 Considering that the areal density of commercialized hard disk media is now as great as 541.5 Gbits/in.…”
Section: Introductionmentioning
confidence: 96%