2020
DOI: 10.1038/s41378-020-00209-y
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Fabrication of on-chip probes for double-tip scanning tunneling microscopy

Abstract: A reduction of the interprobe distance in multiprobe and double-tip scanning tunneling microscopy to the nanometer scale has been a longstanding and technically difficult challenge. Recent multiprobe systems have allowed for significant progress by achieving distances of ~30 nm using two individually driven, traditional metal wire tips. For situations where simple alignment and fixed separation can be advantageous, we present the fabrication of on-chip double-tip devices that incorporate two mechanically fixed… Show more

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Cited by 5 publications
(5 citation statements)
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References 40 publications
(54 reference statements)
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“…Consequently, several attempts have been made to investigate the use of 2D materials in various wearable sensors for detecting diverse biological signals originating at different parts of the human body (Table ). , The human physiological information can be categorized into two classes of physical and chemical signals. The physical signals mainly include body temperature, electrograms, subtle signals, and limb motions.…”
Section: Applications For Flexible Electronicsmentioning
confidence: 99%
“…Consequently, several attempts have been made to investigate the use of 2D materials in various wearable sensors for detecting diverse biological signals originating at different parts of the human body (Table ). , The human physiological information can be categorized into two classes of physical and chemical signals. The physical signals mainly include body temperature, electrograms, subtle signals, and limb motions.…”
Section: Applications For Flexible Electronicsmentioning
confidence: 99%
“…In a second step, variable shape electron beam lithography followed by an RIE step defines the main elements of the probe in the whole device layer thickness, including the ring, its anchors and its tip, the waveguide, the capacitive transducers, and their associated electrical interconnects. Back-side deep RIE, or alternatively a combination of saw dicing and RIE 41 , is realized through the whole thickness of the underlying silicon substrate, intending to make the probe chips detachable from the wafer and to make the tip overhang the chip edge. The ring of the probe is finally released by etching the 1 μm-thick sacrificial oxide layer using vapor HF, and the underetching is controlled so that the ring becomes free to vibrate but remains anchored to the substrate through the spokes and the wider central post.…”
Section: Implementation and Fabricationmentioning
confidence: 99%
“…[25][26][27][28] This has ushered a new standard for electrochemical MIP-based biosensors toward a translational capacity for targets with various sizes and geometries in complex biofluids for selective biosensing. [29][30][31] In case of the NFluidEX, a thin layer of MIP monomer was electropolymerized in the presence of a target template on the NMIs sensor, in which the template was then removed to leave built-in recognition sites to rebind to the target and generate a strong electrical signal. [32,33] The MIP biomimetic receptors are tunable with the morphological and physical characteristics of the target and can be rapidly adapted for various viral subtypes and variants of concern.…”
Section: Introductionmentioning
confidence: 99%