Fabrication of micro-optical elements in quartz by laser induced backside wet etching

Kopitkovas, G.; Lippert, Thomas; Dávid, Christian; Wokaun, Alexander; Gobrecht, J.

doi:10.1016/s0167-9317(03)00099-6

Cited by 74 publications

(36 citation statements)

References 12 publications

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“…More recent developments in LDWϪ include chemically assisted techniques such as laser-drilling ceramics or biomaterials and laser-induced backside wet etching (LIBWE) of glass. 12,13 In fact, one may also consider laser cleaning to be a controlled LDWϪ process. 14 The fundamental interactions leading to material removal can be thermal or athermal, depending primarily on the material/environment characteristics and the pulse duration of the laser.…”

Section: Laser Direct-write Subtraction (Ldw-)mentioning

confidence: 99%

Laser Direct-Write Processing

Arnold¹,

Piqué²

2007

MRS Bull.

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Direct-write techniques enable computer-controlled two-and three-dimensional pattern formation in a serial fashion. Among these techniques, the versatility offered by laser-based direct-write methods is unique, given their ability to add, remove, and modify different types of materials without physical contact between a tool or nozzle and the material of interest. Laser pulses used to generate the patterns can be manipulated to control the composition, structure, and even properties of individual three-dimensional volumes of materials across length scales spanning six orders of magnitude, from nanometers to millimeters. Such resolution, combined with the ability to process complex or delicate material systems, enables laser direct-write tools to fabricate structures that are not possible to generate using other serial or parallel fabrication techniques. The goal of the articles in this issue of MRS Bulletin is to illustrate the range of materials processing capabilities, fundamental research opportunities, and commercially viable applications that can be achieved using recently developed laser direct-write techniques. We hope that the articles provide the reader with a fresh perspective on the challenges and opportunities that these powerful techniques offer for the fabrication of novel devices and structures.

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Section: Laser Direct-write Subtraction (Ldw-)mentioning

confidence: 99%

Laser Direct-Write Processing

Arnold¹,

Piqué²

2007

MRS Bull.

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“…The first one is that the fluence -etch rate graphs can be fitted by two straight lines. This behavior was observed by many research groups [13][14][27][28][29][30][31][32], but correct, coherent explanation have not existed yet. We have already presented a LIBWE model in our previous papers [15,27], which gave relatively good results for LIBWE applying ArF laser (nevertheless the calculated threshold fluence was higher than the measured one), but this model did not work for KrF experiments, namely etching was not predicted in the applied fluence range (up to ≈2 J/cm 2 ).…”

Section: Introductionmentioning

confidence: 81%

“…The nanosecond UV lasers (mostly excimers) would be suitable for micromachining of UV-transparent materials, but the effectiveness is very low due to the high etching threshold fluence, which originates from their transparency. The indirect methods, the laser-induced backside wet/dry etching -LIBWE/LIBDE [11][12][13][14][15][16][17][18][19], laser etching at a surface adsorbed layer -LESAL [20] and laser induced plasma assisted ablation -LIPAA [21] are mainly based on UV (excimer) lasers, which has already proved its suitability in industrial environments.…”

Section: Introductionmentioning

confidence: 99%

Interpretation and Modeling of Laser-Induced Backside Wet Etching Procedure

Vass

Budai

Schay

et al. 2010

JLMN

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Laser-induced backside wet etched fused silica surfaces were characterized by X-ray photoelectron spectroscopy (XPS) and ellipsomerty, and a new numerical model was developed to interpret the etching procedure on the basis of our recent results. ArF and KrF lasers were used for etching, while the applied liquid absorbers were naphthalene/methyl-methacrylate and pyrene/acetone solutions. The XPS measurements showed that the completely cleaned, etched fused silica surface layers were contaminated by carbon (which originated from the organic absorber molecules). The optical parameters of the modified layers were measured by spectroscopic ellipsometer. The thicknesses of these carbon contaminated layers were very thin (between 10 and 30 nm), while their absorption coefficient and the refractive index at 248 nm were between 100 000 and 180 000 cm -1 , and 1.85, respectively. Our previous numerical model was completed on the basis of the determined properties of this modified layer, and our results proved that this layer plays key role in the etching procedure.

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“…Figure 9 shows a sketch of the processes in discussion that are involved in the etching mechanism. In consequence of the laser heating during LIBWE, the softening and the material [23] or phase transitions [32,40,50,64] are discussed with regards to materials erosion. The softened, destabilized, weakened, or even melted material region near the surface might be expelled by mechanical forces resulting from the fast heating, shockwaves, or bubble formation [23].…”

Section: Processes At Laser Backside Etchingmentioning

confidence: 99%

“…All the mentioned backside etching techniques have been used for micro-and nanopatterning of different transparent glass and crystals [22,23,[41][42][43]. Examples are the etching of submicron and nanometer gratings in fused silica [44][45][46] and sapphire [47], the submicron patterning on-thefly with one laser pulse [48], the etching of micro-optical elements [18,39,42,[49][50][51][52][53], and the fabrication of arrays for biomedical purposes [30,54].…”

Section: Introductionmentioning

confidence: 99%

Laser-Induced Backside Wet Etching of Transparent Materials with Organic and Metallic Absorbers

Zimmer

Böhme

2008

Laser Chemistry

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Recommended by Jacques AlbertLaser-induced backside wet etching (LIBWE) allows the high-quality etching of transparent materials for micro-and nanopatterning. Recent own results of LIBWE with hydrocarbon and metallic absorbers (H-and M-LIBWE) are summarized and compared with selected results of other groups regarding the etching process and the etched surface. Significant results on the impact of the liquid absorber, the material and the wavelength, and the pulse length of the laser to the etching are selected for this comparison. The etching of submicron-sized periodic structures in sapphire and fused silica with interference techniques and the selection of the preferred method in dependence on the material and the processing goal discussed. The experimental results are discussed on a thermal model considering both interface and volume absorption of the laser beam. These results have the conclusion that the etching at M-LIBWE is mainly due to material melting and evaporation whereas at H-LIBWE, a modified near-surface region with a very high absorption is ablated.

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Fabrication of micro-optical elements in quartz by laser induced backside wet etching

Cited by 74 publications

References 12 publications

Laser Direct-Write Processing

Laser Direct-Write Processing

Interpretation and Modeling of Laser-Induced Backside Wet Etching Procedure

Laser-Induced Backside Wet Etching of Transparent Materials with Organic and Metallic Absorbers

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