2005
DOI: 10.1088/0957-4484/16/8/020
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Fabrication of metal nanowires by atomic force microscopy nanoscratching and lift-off process

Abstract: A convenient method for the fabrication of metal nanowires by a combination of atomic force microscopy nanoscratching on a single-layer resist and lift-off process is reported. Various metal nanowires, including Au, Cu, Ni, Al, and Ti, with widths as small as 50 nm are successfully created. The electrical resistivities of the nanowires have also been obtained and found to be in good agreement with reported results.

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Cited by 105 publications
(83 citation statements)
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“…Large experimental investigations on Ti nanostructures have been done [8][9][10][11][12][13][14][15][16][17][18][19]. Nakamura et al fabricated titanium nanowires in sapphire by utilizing lattice dislocations which exhibited excellent electrical conductivity [8].…”
Section: Introductionmentioning
confidence: 99%
“…Large experimental investigations on Ti nanostructures have been done [8][9][10][11][12][13][14][15][16][17][18][19]. Nakamura et al fabricated titanium nanowires in sapphire by utilizing lattice dislocations which exhibited excellent electrical conductivity [8].…”
Section: Introductionmentioning
confidence: 99%
“…14,15 If the indentation is made on a single polymer layer, the tip applies vertical force directly to the substrate. [16][17][18] Although this single-layer indentation method could make nanostructures, the AFM tip could be easily damaged because the tip applies the force to the hard substrate directly while making indentations. The ploughing method, which also uses an AFM, is another way to simply fabricate nanowires, but the AFM tip can be easily damaged because of the lateral force applied to it.…”
Section: Introductionmentioning
confidence: 99%
“…Subsequent exposure of the semiconductor surface to an Au(III) solution results in the deposition of gold by galvanic displacement reaction on pre-patterned defect areas. [16][17][18][19][20] have been demonstrated as useful approaches in the fabrication of metal structures on various surfaces.The metallization of semiconductor surfaces via the galvanic displacement reaction has been intensively investigated.2,21-23 Galvanic displacement deposition is a relatively simple redox reaction in which noble metal ions in solutions are reduced by the substrate resulting in growth of metal deposits with various surface morphologies. The surface morphology of electroless deposited metals depends on the substrate, composition of the electrolyte, including pH and conditions of deposition eg.…”
mentioning
confidence: 99%
“…Use of polymer masks to restrict reduction of gold on a specific area has been applied in most of static/dynamic plow-based lithography techniques. [16][17][18][19] In this work a simple three step process for a deposition of 50 nm wide and 10 nm high gold nanowires on GaAs semiconductor is described. This technique may allow the direct deposition of noble metals such as Au, Ag, or similar on GaAs semiconductor surface.…”
mentioning
confidence: 99%
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