2012
DOI: 10.1109/jmems.2012.2184085
|View full text |Cite
|
Sign up to set email alerts
|

Fabrication of Large-Area Three-Dimensional Microstructures on Flexible Substrates by Microtransfer Printing Methods

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1

Citation Types

0
3
0

Year Published

2013
2013
2022
2022

Publication Types

Select...
6

Relationship

2
4

Authors

Journals

citations
Cited by 8 publications
(3 citation statements)
references
References 28 publications
0
3
0
Order By: Relevance
“…The omni‐directional tension provided by the cylindrical transfer stage enabled elastically reversible deformation of the hemispherical membrane into a 2‐D, planar geometry, such that conformal contact between the flattened membrane and the micro‐square‐tube array could be achieved. The Si micro‐square‐tubes were transfer‐printed to the flattened membrane by peeling the membrane away from the SOI (see Figure S2 in SI for more processing details) . Figure e and f present the reverse transformation of the elastomeric membrane relaxing back into a 3‐D, artificial RSCE from the 2‐D, planar layout.…”
Section: Resultsmentioning
confidence: 99%
“…The omni‐directional tension provided by the cylindrical transfer stage enabled elastically reversible deformation of the hemispherical membrane into a 2‐D, planar geometry, such that conformal contact between the flattened membrane and the micro‐square‐tube array could be achieved. The Si micro‐square‐tubes were transfer‐printed to the flattened membrane by peeling the membrane away from the SOI (see Figure S2 in SI for more processing details) . Figure e and f present the reverse transformation of the elastomeric membrane relaxing back into a 3‐D, artificial RSCE from the 2‐D, planar layout.…”
Section: Resultsmentioning
confidence: 99%
“…The detailed fabrication process flow for our bio-inspired cylindrical lens by a peeling micro-transfer printing method is illustrated in Figure 2 [18,19]. The process began with a large-scale array of 3-D, high aspect-ratio silicon (Si) micro-mirrors with highly vertical and smoothened sidewalls on a p-type, (100) silicon-on-insulator (SOI) wafer (80 μm-thick device layer and a 2 μm-thick buried oxide (BOX) layer) via contact-mode lithography, reactive ion etching (RIE) and inductively coupled plasma-based (ICP) deep reactive ion etching (DRIE), as shown in Figure 2a-d, respectively.…”
Section: Fabricationmentioning
confidence: 99%
“…Namely because of the excessive duration of the release etch step, limited active materials (e.g., using harsh acid solutions for the release) and substrate wafers (e.g., required transparent for laser use), lower scale of the transfers (e.g., few mm 2 to cm 2 of patterns), the use of multiple temporary wafers, and lower reliability (e.g., 70% of patterns are transferred). [29,35] As a comparison, the transfer printing proposed in this manuscript enables successful complete transfers of 200 mm wafers.…”
Section: Introductionmentioning
confidence: 99%