2011
DOI: 10.1364/ome.1.001165
|View full text |Cite
|
Sign up to set email alerts
|

Fabrication of high resistivity cold-implanted InGaAsP photoconductors for efficient pulsed terahertz devices

Abstract: A multiple-energy, high fluence, MeV Fe ion implantation process was applied at 83 K to heavily damage a low band gap (0.79 eV) epitaxial InGaAsP layer. Optimal rapid thermal annealing conditions were found and produced a fast photoconductor with high resistivity (up to 2500 Ω cm) and Hall mobility around 400 cm 2 V −1 s −1 . Short photocarrier trapping times (0.3 ps -3 ps) were observed via transient differential reflectivity measurements. Furthermore, photoconductive terahertz devices with coplanar electrode… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3

Citation Types

2
25
0

Year Published

2014
2014
2018
2018

Publication Types

Select...
8
1

Relationship

2
7

Authors

Journals

citations
Cited by 25 publications
(27 citation statements)
references
References 34 publications
2
25
0
Order By: Relevance
“…[9][10][11][12] One of the most promising solutions is the use of a superlattice of monolayers of ErAs in an InGaAs substrate. Since the ErAs layers act as deep recombination centers inside the superlattice, the resistivity and carrier lifetime of such superlattice structures can be controlled by the number and thickness of ErAs layers.…”
mentioning
confidence: 99%
“…[9][10][11][12] One of the most promising solutions is the use of a superlattice of monolayers of ErAs in an InGaAs substrate. Since the ErAs layers act as deep recombination centers inside the superlattice, the resistivity and carrier lifetime of such superlattice structures can be controlled by the number and thickness of ErAs layers.…”
mentioning
confidence: 99%
“…26 Nevertheless, as shown in this work, the composition of this quaternary material can be engineered, and it is possible to produce high quality layers with absorption at 1550 nm. There have been two previous reports of THz photoconductive emission from InGaAsP under excitation from femtosecond lasers, namely using ion implanted material 27 and also the Fe-doped MOCVD material used in this work. 28 Similar to Fe-doped InGaAs, the Fe forms deep acceptors in the active layer, trapping the excess carriers and thus compensating the n-type nature of InGaAsP, and increasing the resistivity of the material.…”
Section: Introductionmentioning
confidence: 99%
“…More complex structures have also been investigated; an ErAs/InGaAs superlattice structure showed a resistivity of 343 Ω cm [12], while a Be-InGaAs/InAlAs superlattice structure achieved a maximum sheet resistance of 1E6 Ω/sq (200 Ω cm dark resistivity) [13,14]. Fe-implanted InGaAsP has also been investigated, showing a maximum resistivity of 2.5 kΩ cm [15,16].…”
Section: Introductionmentioning
confidence: 99%