2008
DOI: 10.1016/j.matlet.2008.08.046
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Fabrication of GaN nanowalls and nanowires using surface charge lithography

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Cited by 23 publications
(15 citation statements)
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“…Selective silicon etching allowed one to fabricate 20–35 nm thick AlN/GaN crystalline porous free‐standing membranes on Si(111) 5. Recently we reported the fabrication of nanometer‐thick GaN membranes suspended on a network of whiskers representing threading dislocations 6, 7 using the approach of surface charge lithography (SCL); SCL is based on direct ion‐beam‐writing of surface negative charge with subsequent photoelectrochemical (PEC) etching of the GaN epilayer 8, 9. In this work, we demonstrate for the first time the maskless fabrication of ultrathin GaN membranes suspended on specially designed GaN micro‐ and nanostructures.…”
mentioning
confidence: 99%
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“…Selective silicon etching allowed one to fabricate 20–35 nm thick AlN/GaN crystalline porous free‐standing membranes on Si(111) 5. Recently we reported the fabrication of nanometer‐thick GaN membranes suspended on a network of whiskers representing threading dislocations 6, 7 using the approach of surface charge lithography (SCL); SCL is based on direct ion‐beam‐writing of surface negative charge with subsequent photoelectrochemical (PEC) etching of the GaN epilayer 8, 9. In this work, we demonstrate for the first time the maskless fabrication of ultrathin GaN membranes suspended on specially designed GaN micro‐ and nanostructures.…”
mentioning
confidence: 99%
“…According to the concept of SCL 6, 7, the treatment of the sample surface by low‐energy ions creates deep acceptors which trap electrons thus forming a shield of negative charge that protects the material against PEC dissolution. Monte Carlo simulations predict the main projected range of the 1 keV Ar + ions in the GaN matrix to be 1.7 nm, while for 30 keV Ga + ions the projected range is of about 14 nm 6, 9. Closed circuit PEC etching was carried out at 300 K in a stirred 0.1 mol aqueous solution of KOH for periods up to 2.5 h under in‐situ UV illumination provided by focusing the radiation of a 350 W Hg lamp to a spot of ∼3.5 mm in diameter on the sample surface.…”
mentioning
confidence: 99%
“…Low-dose low-energy ion-beam treatment induces a negative charge on the semiconductor surface, which shields the material against subsequent PEC etching. Note that SCL proved to be an efficient approach for the purpose of manufacturing GaN nanowalls and nanowires [32].…”
Section: Technologies Applied For the Fabrication Of Gan Membrane Strmentioning
confidence: 99%
“…In this paper, we demonstrate the fabrication of GaN PhC ultrathin membranes using a cost-effective technology based on surface charge lithography [10][11][12][13].…”
Section: Introductionmentioning
confidence: 99%