Fabrication of carbon nanotube emitters in an anodic aluminium oxide nanotemplate on a Si wafer by multi-step anodization

Abstract

AAO template technology was combined with silicon technology to be directly applied to electronic device fabrication. Thin film anodic aluminium oxide (AAO) templates were fabricated on a silicon wafer by multiple anodizations. No electropolishing was used after the deposition of the aluminium layer on Si wafers. The ordering of the pore arrangement was improved by repeated anodizations, and highly ordered AAO templates could be obtained on Si wafers. CNT field emitter arrays were made with the AAO templates on Si wafers. Field emission measurement revealed that the emission current density increased with the synthesis temperature of CNTs. The large field enhancement factor in the range of 2440–4000 indicates the potential of the CNT field emitter array based on the AAO template on a Si wafer.

Microcantilevers with Nanochannels

“…Although we have demonstrated our fabrication method with an aluminum sheet, AAO cantilevers can also be prepared with a thin aluminum film deposited on a silicon wafer. [29] The huge surface area of an AAO microcantilever offers an enormous number of binding sites. The adsorption of chemical or biological molecules on the binding sites of a cantilever shifts the resonance frequency.…”

Field Emission from Nanowires

“…Metallic nanowires of Mo, Cu, Co have been used as nanotips for field emission application (Hwang, 2005;Laurent, 2005;Liao, 2005). Field emission characteristics of electrochemically synthesized nickel nanowires on alumina nanoporous template, with oxygen plasma post treatment, have been reported (Joo, 2006).…”

Atomic Layer Deposition-incorporated Catalyst Deposition for the Vertical Integration of Carbon Nanotubes

“…However, the layer thickness achieved by the traditional deposition techniques cannot be properly controlled inside the channels, thereby degrading the quality of the CNT synthesis. As an alternative approach resulting in better thickness control, a CNT catalyst layer can be buried underneath an insulation layer and exposed by physical etchingwhich is to vertically channel the insulation layer [4][5][6]. In this approach, however, it is difficult to precisely operate in order to stop the physical etching on layers with thicknesses of only a few nanometers.…”