2019
DOI: 10.1016/j.mssp.2018.04.015
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Fabrication of Au gratings by seedless electroplating for X-ray grating interferometry

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Cited by 37 publications
(50 citation statements)
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“…In the following section, we address the fabrication of Si templates that can be used directly as phase modulating gratings or be subsequently filled with high X-ray absorbing materials, such as Ir 70 or Au, 71 and used as analyser gratings. Patterned metal layers were produced by following the schematic procedure of Fig.…”
Section: Patterned Structures For X-ray Opticsmentioning
confidence: 99%
See 1 more Smart Citation
“…In the following section, we address the fabrication of Si templates that can be used directly as phase modulating gratings or be subsequently filled with high X-ray absorbing materials, such as Ir 70 or Au, 71 and used as analyser gratings. Patterned metal layers were produced by following the schematic procedure of Fig.…”
Section: Patterned Structures For X-ray Opticsmentioning
confidence: 99%
“…The pattern was produced by using e-beam lithography in the case of nanostructures and a conventional UV lithography in the case of microstructures. The patterns of X-ray diffractive elements, consisting of linear 72 or circular gratings, 73 were optimized by introducing interconnects between the catalyst lines, which suppress the off-vertical catalyst movement during MacEtch. 29 In detail, bridges were added to a periodic pattern, and some examples of metal patterns before the etching are reported in the ESI † (Fig.…”
Section: Patterned Structures For X-ray Opticsmentioning
confidence: 99%
“…The latter configuration allows using relatively small-area gratings (5 cm × 7 cm) to cover the required FOV ( Fig. 1), which is rather large (26 × 21 cm 2 ) to be spanned with a single grating, considering the corresponding engineering limitations [18]. The GI design parameters (Table 1) were optimized for the differential phase-contrast (DPC) signal following the procedure described in [17], but using a larger inter-grating distance to improve setup sensitivity, which could be achieved by modifying the pre-collimator height.…”
Section: Methodsmentioning
confidence: 99%
“…The presence of the metal catalyst layer at the bottom of the etched structures offers the possibility of using the same as a metallization contact for the subsequent Au electroplating step. With respect to other approaches of the damascene process, [36] the seed growth from the bottom [37,38] does not need any additional step of conformal metallization [39] and allows to create a compact Au filling [40] independently of aspect ratio. [41] The Pt catalyst was designed to have a full interconnected pattern that can be used as metallization for seed growth of Au by electroplating (Figure 1h).…”
Section: Seed Gold Electroplatingmentioning
confidence: 99%
“…[41] The Pt catalyst was designed to have a full interconnected pattern that can be used as metallization for seed growth of Au by electroplating (Figure 1h). The Si trenches were oxidized in air so that they became electrically isolated, [38] thus promoting the growth of Au from the bottom of the trench. As the Pt MacEtch grating has a thick conformal porous layer, the growth of native Si oxide (Figure 1g) is enough to avoid the Au growth on the side walls during electroplating.…”
Section: Seed Gold Electroplatingmentioning
confidence: 99%