Fabrication of a new structured highly efficient wavelength-conversion device by use of the room-temperature-bonding technique

Onda, Tomomi; Hara, Kimihiko; Matsumoto, Shinnosuke; Nagashima, Wataru; Shoji, Ichiro

doi:10.1109/ltb-3d.2012.6238060

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Applications In Optoelectronic Devices1

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“…A wavelength conversion device for generating far‐ultraviolet laser light with high efficiency has been created . An element formed by surface‐activated bonding of stacked crystal plates of the wavelength conversion material β‐BaB 2 O 4 (BBO) with alternating periodic inversion of the crystal axis was used.…”

Section: Applications In Optoelectronic Devicesmentioning

confidence: 99%

Review of Low‐Temperature Bonding Technologies and Their Application in Optoelectronic Devices

Higurashi

Suga

2016

Elect Comm in Japan

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SUMMARYLow-temperature bonding is an important fabrication technique for advanced microelectronics, microelectromechanical systems (MEMS), and optoelectronic devices. Recently, many low-temperature bonding techniques such as surface activated bonding have been studied in order to create unique device structures for a wide range of photonics applications. This paper focuses on low-temperature bonding techniques and reviews the state-of-the-art applications involving optoelectronic devices. C⃝

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Section: Applications In Optoelectronic Devicesmentioning

confidence: 99%