Fabrication of a laser patterned flexible organic light-emitting diode on an optimized multilayered barrier

Abstract

The fast-growing market of organic electronics stimulates the development of versatile technologies for structuring thin-film materials. Ultraviolet lasers have proven their full potential for patterning organic thin films, but only a few studies report on interaction with thin-film barrier layers. In this paper, we present an approach in which the laser patterning process is optimized together with the barrier film, leading to a highly selective patterning technology without introducing barrier damage. This optimization is crucial, as the barrier damage would lead to moisture and oxygen ingress, with accelerated device degradation as a result. Following process optimization, a laser processed flexible organic LED has been fabricated and thin-film encapsulated and its operation is shown for the first time in atmospheric conditions.

Nanostructured Light-Emitting Polymer Thin Films and Devices Fabricated by the Environment-Friendly Push-Coating Technique

“…Straightforward nanopatterning of the electrodes or the emitting layer in light-emitting devices can be achieved with high-cost techniques such as laser-assisted lithography or photolithography − ,, or the low-cost nanoimprinting technology . However, most imprinting methods require heating the polymer layer over its glass-transition temperature (e.g., hot embossing), and consequently, a time-consuming optimization becomes necessary when switching to a new material .…”

Laser–Material Interactions for Flexible Applications

“…Meanwhile, system‐on‐plastic (SoP) consisting of lightweight, portable, and flexible electronics such as energy devices, processors, displays, and other peripheral components integrated on a plastic substrate has recently attracted enormous interest as a next‐generation technology, since it is considered a candidate to potentially replace conventional silicon‐based electronics. It has been developed as flexible organic‐based electronics and displays, in addition to the utilization of roll‐to‐roll processing and inkjet‐printing methods . However, there are remaining challenges that must be addressed for high‐performance bendable electronics to satisfy industrial specifications stemming from insufficient material properties and non‐compatibility with complementary metal‐oxide‐semiconductor (CMOS) processes on plastics.…”