Fabrication of 100 nm pitch copper interconnects by electron beam lithography

Wu, Wei; Jonckheere, R.; Tőkei, Zsolt; Brongersma, S. H.; Hove, M. Van; Maex, Karen

doi:10.1116/1.1771668

Cited by 8 publications

(6 citation statements)

References 6 publications

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“…In recent years, metal nanowires have been the focus of extensive research activities due to their unusual electrical, magnetic, and optical properties and physical applications such as electrical interconnects, , optical waveguides, , and so forth. Furthermore, they can also be used for highly sensitive detection of gas, − chemical, − or biological specimen − owing to the large surface-to-volume ratio.…”

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confidence: 99%

“…Furthermore, they can also be used for highly sensitive detection of gas, − chemical, − or biological specimen − owing to the large surface-to-volume ratio. Fabrication techniques of metal nanowires are consequently of great interest, and various physical and chemical methods, such as electron-beam lithography, ,, chemical reduction, , electrochemical deposition, − templated electrochemical deposition, ,− ,, ,, electromigration, scanning probe nanolithography, − etc., have been developed.…”

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confidence: 99%

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Fabrication of a Single Metal Nanowire Connected with Dissimilar Metal Electrodes and Its Application to Chemical Sensing

2008

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We report a convenient method for the fabrication of a single metal nanowire connected with dissimilar metal electrodes and its application to chemical sensing. The method is based on a combination of atomic force microscopy nanomachining and conventional photolithography. The success of this integrated approach is confirmed by the linear current-voltage behavior of the created nanowires and comparable resistivities with those reported previously. The chemical sensing capability is demonstrated by the selective binding of a self-assembled monolayer onto a single Au nanowire connected with Ti electrodes and the subsequent resistance increase due to increased surface scattering effects after adsorption. It is found that the resistance increases by around 9% after the complete coverage of either octadecanethiol or dodecanethiol molecules onto a 20 nm thick Au nanowire. A theoretical explanation for the relationship between the resistance increase and the alkanethiol concentration is also given.

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confidence: 99%

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confidence: 99%

Fabrication of a Single Metal Nanowire Connected with Dissimilar Metal Electrodes and Its Application to Chemical Sensing

2008

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“…At present, polymethyl methacrylate (PMMA) based polymer resists containing small amounts of light-sensitive active agents are used in nearly all microelectronic processing. Structures <20 nm in width have been prepared using polymer EB resists [6], but 100 nm is a more typical dimension of the features manufactured by current technology [7].…”

Section: Resist Materials For Lithographymentioning

confidence: 99%

Glasses for lithography

Jain

Vlček

2008

Journal of Non-Crystalline Solids

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“…The fabrication of high density features have been studied in many areas using a variety of structures: high density gratings [1], high density magnetic structures [2,3], and high density metal interconnects [4]. The fabrication of high density features have been studied in many areas using a variety of structures: high density gratings [1], high density magnetic structures [2,3], and high density metal interconnects [4].…”

Section: Introductionmentioning

confidence: 99%

Novel Methods to Reduce Pattern Size and Pitch for Data Storage Using Electron Beam Writing

Cartwright

2006

MRS Proc.

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Pattern size and pitch are two major factors that directly affect the ultimate capacity of a data storage unit. Electron beam lithography, because it can be used for direct writing at the nanometer scale, is a candidate for the fabrication of ultra-fine and ultra-compact patterns for the next generation of data storage media.In this paper, we present methods to reduce the pattern size and pitch written by electron beam lithography on the positive tone photo resist Poly(methylmethacrylate) (PMMA). The first method presented uses a writing dose that is much lower than the critical dose of the PMMA. However, in this technique, the distance between the adjacent writing spots (which are approximately Gaussian in spatial extent) is finely adjusted until the partially overlapping Gaussian functions form a contour with periodic dose peaks higher than the critical dose. This overlapping exposure results in a periodic exposure of the PMMA. Most importantly, this writing strategy, using the overlapping of low dose Gaussian beams, results in patterns with smaller size and pitch compared to the conventional methods that use a higher writing dose than the critical dose. To further improve the results, we use ultrasonic development in combination with cold development to greatly increase the resist contrast. The increased contrast results in smaller pattern sizes, and enables smaller pattern pitches, as well as improved pattern uniformity and reproducibility.Finally, as a demonstration of the technique using a conventional beam voltage of 15kV, we demonstrate ultra-fine and high density patterns with ~10nm linewidths and 50nm pitch, which corresponds to a storage capacity near 200 billion bits/inch 2 . By comparison, by using standard techniques (using a dose slightly higher than the critical dose and a normal development strategy), we can only obtain patterns with linewidths of about 20-30nm and pitch of about 100nm.

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Fabrication of 100 nm pitch copper interconnects by electron beam lithography

Abstract: Articles you may be interested inProcess variation-aware three-dimensional proximity effect correction for electron beam direct writing at 45 nm node and beyondIn situ transmission electron microscopy observations of 1.8 μ m and 180 nm Cu interconnects under thermal stresses Appl.

Cited by 8 publications

References 6 publications

Fabrication of a Single Metal Nanowire Connected with Dissimilar Metal Electrodes and Its Application to Chemical Sensing

Fabrication of a Single Metal Nanowire Connected with Dissimilar Metal Electrodes and Its Application to Chemical Sensing

Glasses for lithography

Novel Methods to Reduce Pattern Size and Pitch for Data Storage Using Electron Beam Writing

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