2009
DOI: 10.1063/1.3055415
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Fabrication and characterization of metal-ferroelectric (PbZr0.6Ti0.4O3)-insulator (La2O3)-semiconductor capacitors for nonvolatile memory applications

Abstract: Articles you may be interested inInfluence of work-function of top electrodes on the photovoltaic characteristics of Pb0.95La0.05Zr0.54Ti0.46O3 thin film capacitors Appl. Phys. Lett. 100, 173901 (2012); 10.1063/1.4705425 ( Na 0.5 Bi 0.5 ) 0.87 Pb 0.13 Ti O 3 thin films on different substrates for ferroelectric memory applications Fabrication and characterization of metal-ferroelectric ( Pb Zr 0.53 Ti 0.47 O 3 ) -insulator ( Dy 2 O 3 )semiconductor capacitors for nonvolatile memory applications The charge trapp… Show more

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Cited by 22 publications
(7 citation statements)
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“…This La‐rich dark region can be concluded to be La 2 O 3 secondary phase in accordance with the XRD results. Since La 2 O 3 is an insulator, which may be harmful to the electrical conductivity and thermoelectric performance.…”
Section: Resultsmentioning
confidence: 99%
“…This La‐rich dark region can be concluded to be La 2 O 3 secondary phase in accordance with the XRD results. Since La 2 O 3 is an insulator, which may be harmful to the electrical conductivity and thermoelectric performance.…”
Section: Resultsmentioning
confidence: 99%
“…No hysteresis loops are observed, which indicates a good YSZ/Si interface, and negligible charge injection and ion drift effects. 5,[15][16][17] The memory window can be expressed as follows: The leakage current of YSZ at 1 V is about 7.5ϫ 10 −9 A, which indicates that the insulating property of the YSZ layer satisfies the requirement of this work.…”
mentioning
confidence: 90%
“…3 The I-V curves of Pt/BNT/Si and Pt/BNT/YSZ/Si diodes are shown in Fig. 5,18 The energy band diagram 19 face. The leakage current of Pt/BNT/YSZ/Si diode is smaller than that of Pt/BNT/Si diode, which will contribute to the longer retention time.…”
mentioning
confidence: 99%
“…In the case of MFIS structure, a very thin insulating layer, namely buffer layer, is expected to prevent the chemical reaction and/or inter-diffusion between the ferroelectric film and silicon substrate, and thus improve the interface properties and the retention properties [6,7]. Even so, high quality MFIS FETs with good retention properties have been found arduous to fabricate because of the difficulty in selecting appropriate ferroelectric and dielectric materials [8], [9].…”
Section: Introductionmentioning
confidence: 99%