Fabrication and characterization of aluminum nitride polymer matrix composites with high thermal conductivity and low dielectric constant for electronic packaging

Zhou, Yongcun; Wang, Hong; Wang, Lu; Yu, Ke; Lin, Zude; Li, He; Bai, Yuanyuan

doi:10.1016/j.mseb.2012.03.056

Cited by 114 publications

(59 citation statements)

References 22 publications

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“…Zhou et al [168] prepared ALN/PMMA composites by powder processing technique. And the λ value of the AlN/ PMMA composite with 0.7 vol% AlN fillers was reached to 1.87 W/mK.…”

Section: Alnmentioning

confidence: 99%

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

Yang

Liang

et al. 2018

Adv Compos Hybrid Mater

289

124

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With the fast-developing miniaturization and integration of microelectronics packaging materials, ultrahigh-voltage electrical devices, light-emitting diodes (LEDs), and in areas which require good heat dissipation and low thermal expansion, the investigations on the polymeric composites with highly thermal conductivities and excellent thermal stabilities are urgently required, which would be beneficial to transferring the heat to the outside of the products, finally to effectively avoid substantial overheating and prolong their working life. Our article reviews recent progress in the classification, measurement methods, model and equations, mechanisms, commonly used thermally conductive fillers, and the correlative fabrication methods for the thermally conductive polymeric composites, aiming to understand and grasp how to enhance the λ value effectively. And future perspectives, focusing scientific problems and technical difficulties of the present thermally conductive polymeric composites are also described and evaluated.

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“…Zhou et al [168] prepared ALN/PMMA composites by powder processing technique. And the λ value of the AlN/ PMMA composite with 0.7 vol% AlN fillers was reached to 1.87 W/mK.…”

Section: Alnmentioning

confidence: 99%

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

Yang

Liang

et al. 2018

Adv Compos Hybrid Mater

289

124

View full text Add to dashboard Cite

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“…Only a few papers exist concerning aluminum nitride nanocomposites and these primarily relate to thermal conductivity [30][31][32][33][34][35]. Thermal conductivity values as high as 4 W.m -1 .K -1 have been reported in poly(vinylidene fluoride) (PVDF) [30] and epoxy [30,31] [35].…”

Section: Introductionmentioning

confidence: 99%

The Effects of Water on the Dielectric Properties of Aluminum-Based Nanocomposites

Hosier¹,

Praeger²,

Vaughan

et al. 2017

IEEE Trans. Nanotechnology

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Abstract-A series of polyethylene nanocomposites was prepared utilizing aluminum nitride or alumina nano-powders with comparable morphologies. These were subsequently subjected to different conditioning regimes, namely prolonged storage in vacuum, the ambient laboratory environment or in water. The effect of filler loading and conditioning (i.e. water content) on their morphological and dielectric properties was then examined. Measurements indicated that, in the case of aluminum nitride nanocomposites, none of the conditioning regimes led to significant absorption of water and, as such, neither the dielectric properties nor the DC conductivity varied. Conversely, the alumina nanocomposites were prone to the absorption of an appreciable mass of water, which resulted in them displaying a broad dielectric relaxation, which shifted to higher frequencies, and a higher DC electrical conductivity. We ascribe these different effects to the interfacial surface chemistry present in each system and, in particular, the propensity for hydrogen bonding with water molecules diffusing through the host matrix. Technologically, the use of nanocomposites based upon systems such as aluminum nitride, in place of the commonly used metal oxides (alumina, silica, etc.), eliminates variations in dielectric properties due to absorption of environmental water without resorting to the adoption of techniques such as surface functionalization or calcination in an attempt to render nanoparticle surface chemistry hydrophobic.

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“…A segunda linha de pesquisa é caracterizada pela preparação de compósitos tanto cerâmicos [6,57,112,[127][128][129] como poliméricos [87,130]. Em relação aos compósitos cerâmicos, observaram-se várias justificativas de estudos, tais como: i) compósitos AlN-BN, cujo objetivo é facilitar a usinagem do AlN por meio da adição de BN -usinagem de componentes com geometria complexa [112]; ii) compósitos AlN-TiN, cujo objetivo é montar módulos multicamadas em cerâmica para que o dispositivo eletrônico possa trabalhar acima de 500 ºC [6]; iii) compósitos AlN-SiC, cujo objetivo é possibilitar a manipulação (tailoring) de propriedades elétricas e térmicas, para combinar as melhores propriedades de cada um dos referidos materiais [127]; iv) compósitos AlN-grafeno, cujo objetivo é aumentar a condutividade elétrica e resistência mecânica usando grafeno como material para preenchimento (filler) [128]; e v) compósitos AlNvidro, cujo objetivo é produzir substratos cerâmicos pela tecnologia de cerâmica cossinterizada a baixa temperatura (low temperature cofired ceramic, LTCC) [129].…”

Section: úLtimas Tendências Em Pesquisa De Nitreto De Alumíniounclassified

“…Estes compósitos cerâmicos exibiram diminuição significativa de l e das propriedades mecânicas em comparação com a cerâmica monolítica de AlN. Já a utilização do AlN como material para preenchimento aumentou significativamente as propriedades térmicas e elétricas dos materiais de encapsulamento à base de polímero [87,130].…”

Section: úLtimas Tendências Em Pesquisa De Nitreto De Alumíniounclassified

Processamento, propriedades e aplicações das cerâmicas de nitreto de alumínio

Molisani

2017

Cerâmica

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INTRODUÇÃOA tecnologia planar em silício possibilitou a fabricação de dispositivos eletrônicos miniaturizados (circuitos integrados ou chips). Este processo avançou até atingir dimensões que resultaram em problemas tanto de flexibilização funcional como de custos efetivos, que inviabilizaram a produção de chips com alta complexidade. Os referidos problemas foram solucionados com o advento da tecnologia de circuitos passivos, que é responsável pela fabricação de substratos e componentes para encapsulamento (packaging), os quais são acoplados ao chip de silício para fornecer interconexão,

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Fabrication and characterization of aluminum nitride polymer matrix composites with high thermal conductivity and low dielectric constant for electronic packaging

Cited by 114 publications

References 22 publications

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

The Effects of Water on the Dielectric Properties of Aluminum-Based Nanocomposites

Processamento, propriedades e aplicações das cerâmicas de nitreto de alumínio

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