2020
DOI: 10.1109/led.2020.3034119
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Extremely Stable Dual Gate Coplanar Amorphous InGaZnO Thin Film Transistor With Split Active Layer by N2O Annealing

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Cited by 18 publications
(13 citation statements)
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“…The PBTS and NBTS was performed at VG= ± 20 V at temperature of 60 o C for 1h. This indicates excellent active/gate insulator interface with very less trap sites (14). Environmental stability was performed at 85 o C and 85% humidity for 48 h. There is no detectable change in the device performance as shown in Fig.…”
Section: Resultsmentioning
confidence: 76%
“…The PBTS and NBTS was performed at VG= ± 20 V at temperature of 60 o C for 1h. This indicates excellent active/gate insulator interface with very less trap sites (14). Environmental stability was performed at 85 o C and 85% humidity for 48 h. There is no detectable change in the device performance as shown in Fig.…”
Section: Resultsmentioning
confidence: 76%
“…On the other hand, a negative shift in the binding energy for both Ga 2p (−0.38 eV) and In 3d (−0.25 eV) indicates the carrier increment by defects passivation upon N 2 O PFA. [ 51,54 ]…”
Section: Resultsmentioning
confidence: 99%
“…A self‐align GI etch and doping (without stripping the photoresist before gate formation) by using NF 3 plasma treatment were performed to form N+ a–IGO layer. [ 52,54,56,75–77 ] Note that, the N+ IGO sheet resistance of 507.44 ± 40.3 Ω sq. −1 (ten data points on all over the 15 × 15 cm sample) were measured using the four‐point probe measurement system, suggesting an excellent N+ a‐IGO formation with a N b of 1.71 × 10 20 cm 3 (Table S1, Supporting Information), which was very crucial for good ohmic contact in the coplanar TFT structure.…”
Section: Methodsmentioning
confidence: 99%
“…The deconvoluted O1s spectra for the AD, hotplate crystallized, and N 2 O annealed after HPC are shown in Figure 5a-c. The metal oxide (MO) bond, oxygen vacancy (Vo), and hydroxyl (OH) group peaks were found at 529.8, 531, and 532.1 eV [16,41] respectively for crystalline IGO, and the relative peak area percentages are summarized in Figure 5d and Table 3. The Vo-related peak area ratios for AD and HPC-IGO are similar (17.09% and 16.57%) each other, whereas the OH-related peak area percentage increases significantly from 16.42% to 29.75%.…”
Section: Resultsmentioning
confidence: 99%
“…Afterward, the sample was mounted on a hotplate at a temperature of 350 °C in an air environment to crystallize the a-InGaO film (Figure 1b). A 100 nm thick SiO 2 at 200 °C (a lower temperature than that of the buffer SiO 2 to avoid damage to the underlayer oxide semiconductor, because high-temperature deposition can damage the GI/active interface) [41,54] and a 150 nm Mo layer was then deposited and subsequently patterned as the gate insulator and gate electrode, respectively. NF 3 plasma treatment was performed to create the N+ PC-IGO region with a resistivity of 0.293 Ω-cm to achieve good ohmic contact between the source/drain electrode and the active layer.…”
Section: Methodsmentioning
confidence: 99%