1998
DOI: 10.1116/1.590453
|View full text |Cite
|
Sign up to set email alerts
|

Extreme ultraviolet lithography

Abstract: An extreme ultraviolet (EUV) lithography tool using 13.4 nm radiation is being developed by a consortium of integrated circuit (IC) manufacturers to support 100 nm imaging for integrated circuit production. The 4×, 0.1 NA alpha tool has a >1 μm depth of focus, all reflective optics, a xenon laser plasma source, and robust reflective masks. The technology is expected to support feature scaling down to 30 nm.

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3

Citation Types

0
137
0

Year Published

2001
2001
2012
2012

Publication Types

Select...
3
3
3

Relationship

0
9

Authors

Journals

citations
Cited by 307 publications
(137 citation statements)
references
References 4 publications
0
137
0
Order By: Relevance
“…The spectral behavior of Gd and Tb plasmas is expected to be similar to that of Sn plasmas for the 13.5-nm EUV sources [4][5][6][7][8][9][10], because of the similar atomic structure of 4d open-shell ions [11]. Previous work on rare-earth plasma EUV sources has been focused on absorption spectroscopy by generating quasicontinuum spectra at low laser power [12,13].…”
mentioning
confidence: 99%
See 1 more Smart Citation
“…The spectral behavior of Gd and Tb plasmas is expected to be similar to that of Sn plasmas for the 13.5-nm EUV sources [4][5][6][7][8][9][10], because of the similar atomic structure of 4d open-shell ions [11]. Previous work on rare-earth plasma EUV sources has been focused on absorption spectroscopy by generating quasicontinuum spectra at low laser power [12,13].…”
mentioning
confidence: 99%
“…The focused intensity was varied from 10 10 to 10 13 W/cm 2 with focal spot sizes of 50 µm to compare with the laser wavelength effect and to achieve high laser intensity. The laser was operated in a single shot 4 mode. An absolute EUV energy was measured by use of a calibrated EUV energy meter equipped with a calibrated Mo/B 4 C multilayer mirror [2] and a Zr filter.…”
mentioning
confidence: 99%
“…Due to its capability for large-area fabrication, conventional photo-lithography is a wide-spread fabrication technology. Because the minimum feature size is limited by optical diffraction, sub-micrometer structures can be created by deep ultra-violet (DUV) at hundred-nanometer wavelengths or extreme ultra-violet (EUV) at ten-nanometer wavelengths lithography techniques (Gwyn et al, 1998). Because these technologies require complex vacuum optics, their cost remains prohibitive.…”
Section: Introductionmentioning
confidence: 99%
“…Current interest in super-high-resolution optical systems is related to the development of a number of fundamental and applied fields, such as nanophysics and nanotechnology, X-ray microscopy in the «Water window» and the projection nanolithography in the extreme ultraviolet (EUV) spectral range (Gwyn, 1998;Benschop et al, 1999;Naulleau et al, 2002;Ota et al, 2001;Andreev et al, 2000;Cheng, 1987). The great economical importance in applying the EUV lithography which, as expected, should replace the conventional deep ultraviolet lithography in commercial production of integrated circuits with topology at a level of 10-30 nm dictates a level of efforts carried out in the fields related to the technology.…”
Section: Introductionmentioning
confidence: 99%