2009
DOI: 10.1117/1.3116559
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Extreme ultraviolet interference lithography at the Paul Scherrer Institut

Abstract: We review the performance and applications of an extreme ultraviolet interference lithography ͑EUV-IL͒ system built at the Swiss Light Source of the Paul Scherrer Institut ͑Villigen, Switzerland͒. The interferometer uses fully coherent radiation from an undulator source. 1-D ͑line/ space͒ and 2-D ͑dot/hole arrays͒ patterns are obtained with a transmission-diffraction-grating type of interferometer. Features with sizes in the range from one micrometer down to the 10-nm scale can be printed in a variety of resis… Show more

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Cited by 87 publications
(63 citation statements)
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“…Details of the EUV lithography, available at the Swiss Light Source, can be found elsewhere. 15 This technique provides high resolution patterns over large areas and with high throughput. Briefly, a coherent beam with 13.5 nm wavelength is incident on a mask comprising two identical gratings.…”
mentioning
confidence: 99%
“…Details of the EUV lithography, available at the Swiss Light Source, can be found elsewhere. 15 This technique provides high resolution patterns over large areas and with high throughput. Briefly, a coherent beam with 13.5 nm wavelength is incident on a mask comprising two identical gratings.…”
mentioning
confidence: 99%
“…For example, extreme ultraviolet LIL (EUV-IL) has produced feature sizes down to 10 nm. 31 Some nonuniformity within structures was observed, which was due to photoresist connections between adjacent features, especially for sample 1 at locations R ð0;10Þ , R ð10;10Þ , and R ð10;0Þ . These samples could be treated with oxygen plasma after sample development, which would result in a removal of the connections between adjacent nanostructures and individual features with a higher degree of uniformity.…”
Section: Discussionmentioning
confidence: 99%
“…1(c) shows the intensity map of two-beam interference, where a one-dimensional periodic pattern is formed. The pitch of the pattern is given by d ¼ d m =2m, where d m is the pitch of the mask and m is the diffraction order of the interfering beams from the mask [26]. For photoresists, there is a threshold above which the photoresist becomes soluble or cured during the exposure.…”
Section: Theorymentioning
confidence: 99%