Extreme-Pressure Imprint Lithography for Heat and Ultraviolet-Free Direct Patterning of Rigid Nanoscale Features

Abstract

Nanoimprint lithography (NIL) is typically performed by filling up of molds by heated polymers or UV-curable liquid resists, inevitably requiring subsequent pattern-transfer processes. Although direct NIL techniques have been suggested alternatively, they usually require precursors or ink-type resists containing undesired organic components. Here, we demonstrate extreme-pressure imprint lithography (EPIL) that effectively produces well-defined multiscale structures with a wide range from 10 nm to 10 mm on diverse surfaces even including pure or alloy metals without using any precursors, heating, UV exposure, or pattern transfer. In particular, EPIL is accomplished through precise control of room-temperature plastic deformation in nanoscale volumes, which is elucidated by finite element analyses and molecular dynamics simulations. In addition to scalability to macroscopic areas, we confirm the outstanding versatility of EPIL via its successful applications to Ni, Cu, steel, and organics. We expect that the state-of-the-art EPIL process combined with other emerging nanopatterning technologies will be extendable to the future large-area nanofabrication of various devices.

Functional Asymmetry-Enabled Self-Adhesive Film via Phase Separation of Binary Polymer Mixtures for Soft Bio-Integrated Electronics

“…The fabrication of nanoscale patterns is becoming important for wearable-related electronic devices, such as small sensors, displays, energy harvesting devices that require high performance, and highly integrated devices. ,− Therefore, we propose the patterning of nanometal structures by controlling the adhesiveness of the developed wearable asymmetric adhesive film and the relative interfacial adhesion of the metal mold.…”

Cutting Edge Use of Conductive Patterns in Nanocellulose‐Based Green Electronics

“…[169,170] Generally, lithography-assisted printing has the disadvantages of being expensive, complex, and having multiple steps (Table 2). [146][147][148][149] Seo et al [168] investigated the photoresist patterned Si nanomembrane (NM) CNF paper, and this electrode was used for thin film transistors (TFT) (Figure 3E). The fabricated TFT presented transparent, flexible, and biodegradable properties after 3 weeks.…”

Cu Direct Nanopatterning Using Solid‐State Electrochemical Dissolution at the Anode/Polymer Electrolyte Membrane Interface

“…However, in this process, direct patterning is limited to soft polymers, and fabricating patterns on hard materials, such as metals and semiconductor materials, requires masking with resist and subsequent etching processes. [14][15][16][17][18] Direct nanopatterning on metallic materials via imprint lithography using extremely high pressure has been reported; however, high pressure shortens the lifetime of the mold. [16] Laser beam machining can efficiently fabricate patterns directly on material surfaces.…”

“…[14][15][16][17][18] Direct nanopatterning on metallic materials via imprint lithography using extremely high pressure has been reported; however, high pressure shortens the lifetime of the mold. [16] Laser beam machining can efficiently fabricate patterns directly on material surfaces. [19] However, challenges persist in achieving micro-nanopatterns because of the limitations imposed by the focused spot size of the laser beam.…”