2008
DOI: 10.1109/tia.2008.921388
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Exploration of Power Device Reliability Using Compact Device Models and Fast Electrothermal Simulation

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Cited by 109 publications
(47 citation statements)
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“…Moreover, 3D FEM uses huge computational processes that cannot be interfaced with applications in real time especially in higher switching applications. Other models [60] can be useful for prediction of inverter reliability but they are not applicable in real-time and under in-service operations.…”
Section: Compact Electro-thermal Modelmentioning
confidence: 99%
“…Moreover, 3D FEM uses huge computational processes that cannot be interfaced with applications in real time especially in higher switching applications. Other models [60] can be useful for prediction of inverter reliability but they are not applicable in real-time and under in-service operations.…”
Section: Compact Electro-thermal Modelmentioning
confidence: 99%
“…When the thermal loading profile appearing in the power switching devices is available, a quantitative prediction of the device lifetime under the mission profile is enabled by a rain-flow counting algorithm [41,42]. The rain-flow counting algorithm is a quantitative representation of the thermal loading, which extracts the temperature information in detail in terms of the mean junction temperature , temperature…”
Section: Electrical Domain Thermal Domainmentioning
confidence: 99%
“…This algorithm is commonly used for fatigue analysis in structural engineering, power electronic systems and mechanical vibration applications [32], [33]. In this case, the rainflow counting method considers the state-of-charge (SoC) data as an input and calculates the equivalent cycles.…”
Section: Introductionmentioning
confidence: 99%