Explanation of impact load curve in ball impact test in relation to thermal aging

Daito, Tomoya; Nishikawa, Hiroshi; Takemoto, Tadashi; Matsunami, Takashi

doi:10.1016/j.microrel.2013.05.005

Cited by 7 publications

(4 citation statements)

References 17 publications

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“…The maximum loads to which the soldered joints were subjected were obtained from the load-displacement curves resulting from the ball impact tests. 5) To obtain average values, ball impact tests were performed on 10 solder balls for each soldering condition. Figure 2 shows the effect of the annealing treatment on the maximum load of the load-displacement curve obtained from the ball impact test.…”

Section: Methodsmentioning

confidence: 99%

“…To evaluate the drop reliability, a ball impact test was found to be effective for the qualitative evaluation of the interfacial strength of the solder joints. 5) Reflow soldering using a furnace has been widely used in electronic packaging and assembly processes. However, with the miniaturization of electronic devices and the use of heatsensitive electronic components, the use of the conventional reflow soldering process often gives rise to difficulties.…”

Section: Introductionmentioning

confidence: 99%

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Improvement of Joint Reliability of Sn-Ag-Cu Solder Bumps on Cu by a Laser Process

Nishikawa

Iwata

2015

Mater. Trans.

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Laser soldering has recently been introduced in industry because of its unique properties, which include localized and noncontact heating, a rapid rise and fall in temperature, and easy automation compared to reflow soldering. In this study, the effect of an annealing treatment on the impact strength of solder bumps heated using the laser process was investigated to improve the impact reliability of soldered joints. It was found that, in the as-soldered condition, a thin intermetallic compound (IMC) layer was formed at the interface of the solder bumps on a Cu pad when using the laser process with and without annealing. After aging at 150°C, the impact reliability of the solder bumps heated using the laser process with annealing was superior to that of the solder bumps heated using the laser process without annealing. This was because the IMC grains at the interface clearly grew to a large size. These were effective at preventing Cu atoms from diffusing to the interface of the joints soldered by the laser soldering process and may be the reason that the annealing treatment at 20 W for 5 s prevented the degradation of the maximum load of solder bumps when using the laser soldering at 40 W for 1 s.

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Section: Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Improvement of Joint Reliability of Sn-Ag-Cu Solder Bumps on Cu by a Laser Process

Nishikawa

Iwata

2015

Mater. Trans.

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“…Interest in the mechanical properties of solder joints motivated direct ball impact tests on solder bumps bonded to substrates [17][18][19][20]. In dynamic testing, care must be exercised with regard to the maximum loading rate that can be applied, to ensure reliable measurements when a load cell is employed, because of frequency response limitations.…”

Section: Introductionmentioning

confidence: 99%

A Novel Method for Impact Testing of Small Specimens - Numerical Simulation and Experiments

et al. 2015

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A novel method for dynamic testing of small specimens, based on impact loading, is proposed. This is motivated by the desire to elicit the dynamic mechanical response of single solder joints measuring 0.5 mm smaller in size. Impact loading is generated through impact of a tubular striker against a loading plate which is initially in contact with the specimen. The mechanical response of the specimen is derived from noting the stress waves generated in slender bars attached to the loading plate and specimen. Through this approach, dynamic tension or compression can be conveniently applied using the same test apparatus, and exact alignment of the slender bars attached is not critical. In addition, wave dispersion or attenuation in the bars (e.g., when polymer bars are used) has much less influence on the accuracy of results obtained. The equations governing this novel approach are derived and validated by finite element modeling. A prototype of a miniature impact tester was consequently fabricated, and tests on small aluminum specimens showed results comparable to that employing traditional split Hopkinson bar systems. The test arrangement was utilized for dynamic testing of lead-free single solder joint specimens, and initial results obtained are presented.

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“…In recent years, the electrolessly plated Ni-Co-P alloys was also investigated as the diffusion barrier layer in the ultra large-scale integration (ULSI) technology [26,29,30]. Interfacial reaction between lead-free solder and Ni-Co-P plating was reported by Daito et al [31]. However, their 2-page report mainly looked into wetting spread area comparison among Ni-P. Co-P, and Ni-Co-P. No information on the chemical composition of the Ni-Co-P plating was available; neither were there any IMC phase identification and solder joint reliability.…”

Section: Introductionmentioning

confidence: 99%

Interface reaction between an electroless Ni–Co–P metallization and Sn–3.5Ag lead-free solder with improved joint reliability

et al. 2014

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Explanation of impact load curve in ball impact test in relation to thermal aging

Cited by 7 publications

References 17 publications

Improvement of Joint Reliability of Sn-Ag-Cu Solder Bumps on Cu by a Laser Process

Improvement of Joint Reliability of Sn-Ag-Cu Solder Bumps on Cu by a Laser Process

A Novel Method for Impact Testing of Small Specimens - Numerical Simulation and Experiments

Interface reaction between an electroless Ni–Co–P metallization and Sn–3.5Ag lead-free solder with improved joint reliability

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