Experimentation at the Micron and Submicron Scale

Chasiotis, Ioannis; Knauss, W. G.

doi:10.1016/b0-08-043749-4/08038-1

Cited by 22 publications

(20 citation statements)

References 134 publications

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“…To date, thin film mechanical testing methods developed for MEMS-scale specimens provided the Young_s modulus (a detailed review is given in [1]) while very few methods measured both elastic constants directly from microscale specimens. First, Sharpe et al [2] reported the Poisson_s ratio of polysilicon using 0.6-mm wide and 4-mm long specimens and interferometric displacement measurements.…”

Section: Introductionmentioning

confidence: 99%

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Elastic Properties and Representative Volume Element of Polycrystalline Silicon for MEMS

Cho

Chasiotis

2006

Exp Mech

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A nanoscale mechanical deformation measurement method was employed to obtain the Young_s modulus and Poisson_s ratio of polycrystalline silicon for Microelectromechanical Systems (MEMS) from different facilities, and to assess the scale at which these effective properties are valid in MEMS design. The method, based on in situ Atomic Force Microscope (AFM) imaging and Digital Image Correlation (DIC) analysis, employed 2-2.5 mm thick freestanding specimens with surface measurement areas varying between 1 Â 2 and 5 Â 15 mm 2 . The effective mechanical properties were quite invariant with respect to the fabrication facility: the Poisson_s ratio of polycrystalline silicon from the Multi-user MEMS Processes (MUMPs) and from Sandia_s Ultra planar four layer Multilevel MEMS Technology (SUMMiT-IV) was 0.22 T 0.02, while the elastic moduli for MUMPs and SUMMiT-IV polysilicon were 164 T 7 and 155 T 6 GPa, respectively. The AFM/DIC method was used to determine the size of the material domain whose mechanical behavior could be described by the isotropic constants. For SUMMiT polysilicon with columnar grains and 650 nm average grain size, it was found that a 10 Â 10-mm 2 specimen area, on average containing 15 Â 15 columnar grains, was a representative volume element. However, the axial displacement fields in 4 Â 4 or 2 Â 2 mm 2 areas could be highly inhomogeneous and the effective behavior of these specimen domains could deviate significantly from that described by isotropy. As a consequence, the isotropic material constants are applicable to MEMS components comprised of 15 Â 15 or more grains, corresponding to specimen areas equal to 10 Â 10 mm 2 for SUMMiT and 5 Â 5 mm 2 for MUMPs, and do not provide an accurate description of the mechanics of smaller MEMS components.

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Section: Introductionmentioning

confidence: 99%

“…It is considered modestly anisotropic with a modulus varying between 130.2 < E < 187.9 GPa in [100] and [111] directions, respectively [1]. Films with 1-mm or larger thickness are usually comprised of relatively columnar grains with 300-600 nm average grain size that depends on the fabrication method.…”

Section: Introductionmentioning

confidence: 99%

Elastic Properties and Representative Volume Element of Polycrystalline Silicon for MEMS

Cho

Chasiotis

2006

Exp Mech

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“…In this regard, several experimental methods have been developed to measure the elastic and failure properties of materials for use in MEMS devices. A thorough literature review is provided in [3].…”

Section: Introductionmentioning

confidence: 99%

Strength and Fracture Resistance of Amorphous Diamond‐Like Carbon Films for MEMS

Jonnalagadda

Chasiotis

2009

Journal of Nanomaterials

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The mechanical strength and mixed mode I/II fracture toughness of hydrogen-free tetrahedral amorphous diamond-like carbon (ta-C) films, grown by pulsed laser deposition, are discussed in connection to material flaws and its microstructure. The failure properties of ta-C were obtained from films with thicknesses 0.5-3 μm and specimen widths 10-20 μm. The smallest test samples with 10 μm gage section averaged a strength of 7.3 ± 1.2 GPa, while the strength of 20-μm specimens with thicknesses 0.5-3 μm varied between 2.2-5.7 GPa. The scaling of the mechanical strength with specimen thickness and dimensions was owed to deposition-induced surface flaws, and, only in the smallest specimens, RIE patterning generated specimen sidewall flaws. The mode I fracture toughness of ta-C films is K Ic = 4.4 ± 0.4 MPa √ m, while the results from mixed mode I/II fracture experiments with cracks arbitrarily oriented in the plane of the film compared very well with theoretical predictions.

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“…Instruments with atomic resolution, such as the atomic force microscopy, high resolution electron microscopy and nano-moire method, enable the investigation of surface and bulk material properties at a nanoscale [15,16].…”

Section: Received 28 May 2003mentioning

confidence: 99%

MD simulation for nanocrystals

Xiling

Wei

2003

Acta Mech Sinica

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Molecular dynamic (MD) provided an ab initio simulation for nano-scale mechanical behavior of materials, provided that the inter-atomic potential is accurately prescribed. MD is particularly suitable in simulating the formation, the deformation, and the evolution of nanocrystals under a fast strain rate. To tackle large scale system and nano-seconds time duration, parallel algorithm is desired. The present paper reviews the recent advances in MD simulation for nanocrystals with attention focused on the applications toward nanomechanics. The examined issues are: formation of nanocrystalline metals, nanoindentation on nanocrystals, fast deformation of nanocrystals, orderdisorder transition, and nano-particle impact.

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Experimentation at the Micron and Submicron Scale

Cited by 22 publications

References 134 publications

Elastic Properties and Representative Volume Element of Polycrystalline Silicon for MEMS

Elastic Properties and Representative Volume Element of Polycrystalline Silicon for MEMS

Strength and Fracture Resistance of Amorphous Diamond‐Like Carbon Films for MEMS

MD simulation for nanocrystals

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