1976
DOI: 10.6028/jres.080a.008
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Experimental values for the elastic constants of a particulate-filled glassy polymer

Abstract: Young' s modu lus and Poisso n's ratio have bee n measured simulta neo usly on a seri es of pa rti c ul a te co mposites co ntainin g vo lum e fra cti ons of fill e r up to 0.50. The co mpos ites co nsisted of small glass s ph e res im bedd ed in a ri gi d e poxy po lym e r matri x. The meas ured va lues we re com pared with th eOl·eti-cal valu es calc ul ated from c urre nt theories. A rece ntl y ge ne ralized a nd simplifi ed ve rs ion of van der Poe l' s th eo ry prov id ed th e bes t agreeme nt. It predict… Show more

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Cited by 102 publications
(78 citation statements)
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“…Circuit board Silica-based E-glass, which has a CTE of ~5 x 10" ^/°C, has been widely utiHzed as a particulate filler in epoxy-based resins to reduce the overall CTE of the potting compound, making it more suitable for electronics applications [2,6]. These types of encapsulating compounds are inexpensive and commonly used in a wide range of commercial electronics products, from personal computers to cell phones [3].…”
Section: Device Potting Compoundmentioning
confidence: 99%
See 1 more Smart Citation
“…Circuit board Silica-based E-glass, which has a CTE of ~5 x 10" ^/°C, has been widely utiHzed as a particulate filler in epoxy-based resins to reduce the overall CTE of the potting compound, making it more suitable for electronics applications [2,6]. These types of encapsulating compounds are inexpensive and commonly used in a wide range of commercial electronics products, from personal computers to cell phones [3].…”
Section: Device Potting Compoundmentioning
confidence: 99%
“…Such hollow glass fillers are readily available at low cost and are termed microspheres, hollow glass beads, hollow glass spheres, or microballoons. These microspheres, through variations in glass wall thickness and particle diameter, have low densities in the range of 0.1-1.0 g/cm^ [6]. Hollow glass microspheres have been widely employed as particulate filler in polymeric systems for over three decades [8].…”
Section: Device Potting Compoundmentioning
confidence: 99%
“…En cuanto a la influencia del material de las partículas, la comparación de las Figs. 7 y 8 permite observar, que aunque las partículas de SiC presentan valores más altos de módulo de elasticidad y límite elástico que las de alúmina (Tabla I), su incorporación a la matriz no se traduce de igual modo en una mejora de las propiedades del compuesto, ya que también es preciso considerar la adherencia partícula-matriz en este tipo de materiales (14).…”
Section: Comportamiento Estático a Compresiónunclassified
“…EXPERIMENTAL DATA Figure 5 shows a comparison between plenty of experimental results from literature [27][28][29][30][31][32][33][34][35][36][37][38] and the analytical predictions of our model for the Young's modulus (a)-(g), the shear modulus (h), and Poisson s ratio (i). Upper and lower bounds from several classical model are additionally provided in Fig.…”
Section: Verification By the Previousmentioning
confidence: 99%