Characterization of Low Density Glass Filled Epoxies

Quesenberry, Matthew J.; Madison, Phillip H.; Jensen, Robert E.

doi:10.21236/ada412137

Cited by 10 publications

(13 citation statements)

References 17 publications

(28 reference statements)

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“…For the glass MS/CE composites, the tensile modulus increased from 2.7 GPa for the neat CE to 5.2 GPa for the 40 wt% (24.5 vol%) glass MS/CE composite. Quesenberry et al reported an increase in tensile modulus from ∼ 2.8 GPa (neat epoxy) to ∼4.5 GPa for 25 vol% solid glass spheres/epoxy composite. Similarly, Lee et al reported an increased modulus from about 2.8 GPa for the neat epoxy, to ∼4.9 GPa for 20 vol% glass MS. Our tensile modulus results reported here are similar.…”

Section: Resultsmentioning

confidence: 99%

Thermal, electrical, and mechanical properties of talc‐ and glass microsphere‐Reinforced Cycloaliphatic epoxy composites

et al. 2017

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Cycloaliphatic epoxy (CE) is used in high voltage and temperature applications because of its high glass transition temperature and resistance to ultraviolet, ozone, and hydrothermal aging mechanisms. Fillers can be used to increase the tensile modulus and thermal conductivity (TC) without a corresponding increase in electrical conductivity (1/electrical resistivity [ER]), which would be detrimental in a high voltage environment. In this study, two fillers were examined in a CE system: talc and glass microspheres (MS). Up to 20 wt% talc/CE and up to 40 wt% glass MS/CE composites were fabricated and tested for ER, TC, and tensile properties. As desired, all composites remained electrically resistive. Composite TC increased with increasing filler content from 0.15 W/m‐K for the neat epoxy to 0.25 W/m‐K for 20 wt% talc and for 40 wt% glass MS. This TC increase could be helpful to dissipate heat in high voltage and temperature applications. Tensile modulus increased from 2.7 GPa for the neat epoxy to 3.6 GPa for 20 wt% talc/CE and to 5.2 GPa for 40 wt% glass MS/CE composites. Increasing the tensile modulus is useful in the newly developed Polymer Core Composite Conductors that are used to transmit power. POLY COMPOS., 39:E1581–E1588, 2018. © 2017 Society of Plastic Engineers

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Section: Resultsmentioning

confidence: 99%

Thermal, electrical, and mechanical properties of talc‐ and glass microsphere‐Reinforced Cycloaliphatic epoxy composites

et al. 2017

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“…These materials can take a variety of forms (5,6). They can be filled or unfilled thermosetting epoxy resins.…”

Section: Encapsulationmentioning

confidence: 99%

Electronic Components for High-g Hardened Packaging

Berman¹

2006

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Approved for public release; distribution is unlimited.ii REPORT DOCUMENTATION PAGE Form Approved OMB No. 0704-0188Public reporting burden for this collection of information is estimated to average 1 hour per response, including the time for reviewing instructions, searching existing data sources, gathering and maintaining the data needed, and completing and reviewing the collection information. Send comments regarding this burden estimate or any other aspect of this collection of information, including suggestions for reducing the burden, to Department of Defense, Washington Headquarters Services, Directorate for Information Operations and Reports (0704-0188), 1215 Jefferson Davis Highway, Suite 1204, Arlington, VA 22202-4302. Respondents should be aware that notwithstanding any other provision of law, no person shall be subject to any penalty for failing to comply with a collection of information if it does not display a currently valid OMB control number.

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“…Many researchers have experimentally determined the mechancial properties of filled polymeric composites [10 -13]. Matthew Quesenberry et al [14], have experimentally studied the characteristics of low density glass filled epoxies on density, co-efficient of thermal expansion and composite modulus. A comparative experimental study has been made between solid glass filler, hollow glass filler and combination of both solid and hollow filler for various volume fractions.…”

Section: Introduction mentioning

confidence: 99%

Stochastic Numerical Simulation for the Evaluation of Mechanical Properties of Filled Polymer Composites

Subramaniam¹,

Krishnaveni²,

Jeyaraj³

et al. 2017

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Reinforced polymeric composites are profoundly used in variety of applications due to its high strength to weight ratio and ease of fabrication. The wide spread application of reinforced polymeric materials in the electronic industries have created a great demand in fabricating a kind of reinforced polymeric system, which is light but has better mechanical strength and good thermal properties. Especially glass microsphere filled epoxy resin composites is used as a potting compound in electronic and aviation industries. Therefore, knowledge of the fundamental thermal and mechanical properties of these systems is highly essential in the formulation of advanced electronic potting compounds. In this work, the effective mechanical properties of glass microsphere filled epoxy system is investigated numerically by stochastic simulation. Numerical simulation software ANSYS is used to characterise the microstructure of the filled epoxy system. MATLAB code has been developed to model the randomness of the particle. The geometric model generated from the MATLAB code is given as an input to ANSYS. Random particle Representative Volume Element (RVE) model is used to evaluate the mechanical properties at various loading fractions. The effect of particle size on mechanical properties of glass microsphere filled epoxy composite is studied. Further the random RVE modeling scheme is compared with single RVE modeling scheme and its significance is reported. The numerically predicted values of effective modulus is then compared with the analytical models and with the literature experimental data. Also the significance of the analytical model on the determination of properties is reported. Then, the effect of interface on the mechanical characterisation by stochastic model is analysed and the debonding of the particle is also simulated.

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Characterization of Low Density Glass Filled Epoxies

Cited by 10 publications

References 17 publications

Thermal, electrical, and mechanical properties of talc‐ and glass microsphere‐Reinforced Cycloaliphatic epoxy composites

Thermal, electrical, and mechanical properties of talc‐ and glass microsphere‐Reinforced Cycloaliphatic epoxy composites

Electronic Components for High-g Hardened Packaging

Stochastic Numerical Simulation for the Evaluation of Mechanical Properties of Filled Polymer Composites

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