Experimental study on heat transfer of jet impingement with a moving nozzle

Ai, Xinghao; Xu, Zhengguo; Zhao, Chuang-Yao

doi:10.1016/j.applthermaleng.2017.01.004

Cited by 20 publications

(3 citation statements)

References 22 publications

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“…A lot of experimental and numerical studies of the slit jet impinging process in a moving state have been reported as well. [15][16][17][18] Ai et al 19) pointed out that a moving nozzle enhances heat transfer and temperature uniformity more than a fixed nozzle. Benmouhoub et al 20) numerically investigated the global structure and heat transfer for a confined slot jet impinging on a moving surface with a range of jet exit Re, plate velocity ratios, and jet inclination.…”

Section: Heat Transfer Characteristic Of Slit Nozzle Impingement On Hmentioning

confidence: 99%

Heat Transfer Characteristic of Slit Nozzle Impingement on High-temperature Plate Surface

Wang¹,

Liu²,

Zhang³

et al. 2019

ISIJ Int.

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Section: Heat Transfer Characteristic Of Slit Nozzle Impingement On Hmentioning

confidence: 99%

Heat Transfer Characteristic of Slit Nozzle Impingement on High-temperature Plate Surface

Wang¹,

Liu²,

Zhang³

et al. 2019

ISIJ Int.

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“…They have observed that the maximum heat flux is a function of surface geometry and orientation but independent of surface roughness. (Ai et al, 2017) The experimental investigation of jet impingement using moving nozzles was studied by (Ai et al, 2017). They have also compared the heat transfer effect of fixed and moving nozzles.…”

Section: Experimental Techniquesmentioning

confidence: 99%

A Review on Cooling of Discrete Heated Modules Using Liquid Jet Impingement

Hotta¹,

Patil²

2018

Frontiers in Heat and Mass Transfer

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The manuscript deals with the critical review for cooling of discrete heated electronic components using liquid jet impingement. Cooling of electronic components has been a lead area of research in recent years. Due to the rapid growth of electronic industries, there is an enormous rise in the system power consumption, and the reduction in the size of electronic components has led to a rapid increase in the heat dissipation rate per unit volume of components. The present paper deals with the role of liquid jet impingement (heat flux removal rate 200-600 W/cm 2) for cooling of electronic components. The type of working fluids (Water / Fluorocarbon liquids / Dielectric fluids / Nanofluids) used for cooling, mode of heat transfer (Natural / Forced / Mixed) from electronic components, and the method of analysis (Experimental / Numerical / Combination of both) greatly influence the cooling mechanism. The electronic components considered in the present study are limited to microelectronic chips, VLSI circuit chips, integrated circuits (IC) chips and resistors. Most of the literature is pertinent to cooling of square heat sources, and many of the researchers have also focused on the comparative studies using different working fluids. Results suggest that Fluorocarbon liquids can be used for higher heat flux removal due to their high boiling point. The temperature drop obtained from the electronic components using liquid jet impingement was found to be in the range of 80-85ºC.

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“…Lots of research had been done to improve the heat transfer performance of jet impingement. Ai et al 9) found that reducing nozzle diameter could contribute to the improvement of heat transfer performance at the same outlet flow. Chester and Hauksson et al 10,11) found that increasing flow rate and velocity could improve the heat transfer ability of the hot plate surface.…”

Section: Introductionmentioning

confidence: 99%