Experimental study of WL-CSP reliability subjected to a four-point bend-test

Coq, Cédric Le; Tougui, Adellah; Stempin, Marie-Pascale; Barreau, Laurent

doi:10.1016/j.microrel.2010.03.015

Cited by 11 publications

(1 citation statement)

References 13 publications

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“…Liu Fang etc get the fracture mode of Lead-free solder ball is the brittle fracture of the IMC layer [4] ; In abroad, It is one of the hot issues to research the reliability behavior of package drop. They use many methods to analyze the package dynamic mechanics performance, such as using the finite element analysis, improving the experiment instrument, changing weld layer of the internal encapsulation components [5][6][7] .…”

Section: Introductionmentioning

confidence: 99%

Failure Analysis of the Solder Joints in Flip-Chip BGA Packages under Free-Drop Test

Guo

Xia

Shu

2014

AMR

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The failure of plastic ball grid array under intense dynamic loading was studied in the project. This paper presents the drop test reliability results of SnPb flip-chip on a standard JEDEC drop reliability test board. The failure mode and mechanism of planar array package in the drop test was comprehensively analyzed. High acceleration dropping test method was used to research the reliability of BGA (ball grid array) packages during the free-drop impact process. The model RS-DP-03A drop device was used to simulate the falling behavior of BGA chip packages under the real conditions, The drop condition meets the JEDEC22-B111 standards (pulse peak 1500g, pulse duration 0.5 ms) when dropping from the 650mm height . In the testing, according to the real-time changes of dynamic voltage, the relationship between drop times and different phases of package failure was analyzed. With the dye-penetrated method and optical microscopy, it was easy to observe the internal crack and failure locations. The growth mechanism of the cracks in solder joints under the condition of drop-free was analyzed and discussed.

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Section: Introductionmentioning

confidence: 99%

Failure Analysis of the Solder Joints in Flip-Chip BGA Packages under Free-Drop Test

Guo

Xia

Shu

2014

AMR

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Evaluating the Impact of Dwell Time on Solder Interconnect Durability Under Bending Loads

Menon

Osterman

Pecht

2015

Journal of Elec Materi

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With the increasing portability and miniaturization of modern-day electronics, the mechanical robustness of these systems has become more of a concern. Existing standards for conducting mechanical durability tests of electronic assemblies include bend, shock/drop, vibration, and torsion. Although these standards provide insights into both cyclic fatigue and overstress damage incurred in solder interconnects (widely regarded as the primary mode of failure in electronic assemblies), they fail to address the impact of timedependent (creep) behavior due to sustained mechanical loads on solder interconnect durability. It has been seen in previous studies that solder durability under thermal cycling loads is inversely proportional to the dwell time or hold time at either temperature extreme of the imposed temperature cycle. Fatigue life models, which include dwell time, have been developed for solder interconnects subject to temperature cycling. However, the fatigue life models that have been developed in the literature for solder interconnects under mechanical loads fail to address the influence of the duration of loading. In this study, solder interconnect test vehicles were subjected to cyclic mechanical bending with various dwell times in order to understand the impact of the duration of mechanical loads on solder interconnect durability. The solder interconnects examined in this study were formed with 2512 resistor packages using various solder compositions [tin-lead (Sn-Pb) and 96.5Sn-3Ag-0.5Cu (SAC305)]. To evaluate the impact of dwell time, the boards were tested with 0 s, 60 s, and 300 s of dwell time at both extremes of the loading profile. It was observed that an increase in the dwell time of the loading profile resulted in a decrease in the characteristic life of the solder interconnects. The decrease in fatigue life was attributed to increased creep damage as identified using finite-element simulations. An energy partitioning approach was then used to estimate the mean cycles to failure for the various testing conditions. The estimated mean cycles to failure were within 10% of the experimentally obtained mean cycles to failure.

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Mechanical behavior of solder joints under dynamic four-point impact bending

Qin

2011

Microelectronics Reliability

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Experimental study of WL-CSP reliability subjected to a four-point bend-test

Cited by 11 publications

References 13 publications

Failure Analysis of the Solder Joints in Flip-Chip BGA Packages under Free-Drop Test

Failure Analysis of the Solder Joints in Flip-Chip BGA Packages under Free-Drop Test

Evaluating the Impact of Dwell Time on Solder Interconnect Durability Under Bending Loads

Mechanical behavior of solder joints under dynamic four-point impact bending

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