Mechanical behavior of solder joints under dynamic four-point impact bending

An, Tong; Qin, Fei; Li, Jiangang

doi:10.1016/j.microrel.2010.12.009

Cited by 27 publications

(3 citation statements)

References 22 publications

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“…It is worth noting that the interface between the solder and the substrate has a high impact on the solder connection as well as the quality of the product. Therefore, in order to understand intermetallic compounds, it is necessary to firmly grasp crystal growth kinetics [10–12].…”

Section: Introductionmentioning

confidence: 99%

Exploring Zn doped η′‐Cu₆Sn₅: Structural stability, fracture toughness and thermal conductivity

Yang

Peng

et al. 2023

Int J of Quantum Chemistry

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In order to investigate the effect of alloying elements on mechanical properties of η 0 -Sn-Cu alloys, the effect of Zn-doping on the structural stability, elasticity, electrical and thermodynamic properties of η 0 -Cu 6 Sn 5 intermetallic in Sn-Cu alloys have been calculated by first-principles calculations. The results show that the Zn-doped η 0 -Cu 6 Sn 5 are thermodynamically and dynamically stable. The doped phase is the most stable when Zn replaces Cu1 site. The bulk modulus and shear modulus of η 0 -Cu 6 Sn 5 with Zn-doped Sn1 site are the highest. When Zn replaces Sn, the stiffness is stronger than that when Zn replaces Cu, and the stiffness order is Zn-Sn > Zn-Cu > η 0 -Cu 6 Sn 5 . Compared with other doping sites, the 3D surface configurations of elastic modulus of Zn-Sn1 η 0 -Cu 6 Sn 5 are the largest. In addition, Zn doping improves the fracture toughness and chemical bond strength of the material. The thermal conductivity and electron thermal conductivity of η 0 -Cu 6 Sn 5 also increased.

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Section: Introductionmentioning

confidence: 99%

Exploring Zn doped η′‐Cu₆Sn₅: Structural stability, fracture toughness and thermal conductivity

Yang

Peng

et al. 2023

Int J of Quantum Chemistry

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“…For estimating component life under vibration, Wu (2010) identified the critical parameters that influence ball grid array and package fatigue life by determining the response of the PCB and also the values of the critical stress in the components of interest based on beam bending theory. Similarly, An et al (2011) investigated mechanical and failure behavior of solder joints in a boardlevel package under drop impact loadings with measuring PCB strain and deflection. Specifically, the maximum von Mises stress in the critical solder joint was considerably affected by PCB stiffness and thus deflection (Qin et al, 2008).…”

Section: Introductionmentioning

confidence: 99%

Effect of high-frequency PCB laminate on thermal cycling behavior of electronic packaging structures

Huang

Zhu

et al. 2022

MMMS

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PurposeAs the solution to improve fatigue life and mechanical reliability of packaging structure, the material selection in PCB stack-up and partitioning design on PCB to eliminate the electromagnetic interference by keeping all circuit functions separate are suggested to be optimized from the mechanical stress point of view.Design/methodology/approachThe present paper investigated the effect of RO4350B and RT5880 printed circuit board (PCB) laminates on fatigue life of the QFN (quad flat no-lead) packaging structure for high-frequency applications. During accelerated thermal cycling between −50 °C and 100 °C, the mismatched coefficients of thermal expansion (CTE) between packaging and PCB materials, initial PCB warping deformation and locally concentrated stress states significantly affected the fatigue life of the packaging structure. The intermetallics layer and mechanical strength of solder joints were examined to ensure the satisfactorily soldering quality prior to the thermal cycling process. The failure mechanism was investigated by the metallographic observations using a scanning electron microscope.FindingsTypical fatigue behavior was revealed by grain coarsening due to cyclic stress, while at critical locations of packaging structures, the crack propagations were confirmed to be accompanied with coarsened grains by dye penetration tests. It is confirmed that the cyclic stress induced fatigue deformation is dominant in the deformation history of both PCB laminates. Due to the greater CTE differences in the RT5880 PCB laminate with those of the packaging materials, the thermally induced strains among different layered materials were more mismatched and led to the initiation and propagation of fatigue cracks in solder joints subjected to more severe stress states.Originality/valueIn addition to the electrical insulation and thermal dissipation, electronic packaging structures play a key role in mechanical connections between IC chips and PCB.

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“…Sources:Ma and Suhling (2009);An et al (2011);Abtew and Selvaduray (2000);Glazer (1995);Talukder (2023) …”

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confidence: 99%

Flow behavior during solder/Cu column friction plunge micro-welding

Zhao,

Zhang,

Meng

et al. 2023

SSMT

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Purpose The author proposed a friction plunge micro-welding (FPMW) method and applied it to column grid array packaging to realize the connection of copper columns without precision molds assisted positioning. The purpose of this paper is to study the flow behavior of the solder undergoing frictional thermo-mechanical action during the FPMW and to determine the source of the solders in the micro-zones with different microstructure characteristics near the solder/Cu column friction interface. Design/methodology/approach Three kinds of Sn58Bi/SAC305 and SAC305/Pb90Sn composite solder samples were designed to study the flow behavior of the solder during FPMW using Bi and Pb as tracer elements. Findings The results show that most of the solders in the position occupied by the copper column was softened and plasticized during the welding process and was extruded to side of the copper column, flowing axially, circumferentially and radially along a trajectory similar to a conical spiral line. Under the drive of the tangential friction force and the radial hold-tight force, the extruded out visco-plastic solders fully mixed with the visco-plastic solders on the sides of the copper column, and bonded with the solders that deformed plastically on the periphery, so that a stir zone and a dynamic recrystallization zone finally evolved. The outside plastically deformed solders evolved into a thermo-mechanical affected zone. Originality/value The flow behavior of the solder during the FPMW was determined, as well as the source of the solders in micro-zones with different microstructure characteristics.

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Mechanical behavior of solder joints under dynamic four-point impact bending

Cited by 27 publications

References 22 publications

Exploring Zn doped η′‐Cu₆Sn₅: Structural stability, fracture toughness and thermal conductivity

Exploring Zn doped η′‐Cu₆Sn₅: Structural stability, fracture toughness and thermal conductivity

Effect of high-frequency PCB laminate on thermal cycling behavior of electronic packaging structures

Flow behavior during solder/Cu column friction plunge micro-welding

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Mechanical behavior of solder joints under dynamic four-point impact bending

Cited by 27 publications

References 22 publications

Exploring Zn doped η′‐Cu6Sn5: Structural stability, fracture toughness and thermal conductivity

Exploring Zn doped η′‐Cu6Sn5: Structural stability, fracture toughness and thermal conductivity

Effect of high-frequency PCB laminate on thermal cycling behavior of electronic packaging structures

Flow behavior during solder/Cu column friction plunge micro-welding

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Product

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Exploring Zn doped η′‐Cu₆Sn₅: Structural stability, fracture toughness and thermal conductivity

Exploring Zn doped η′‐Cu₆Sn₅: Structural stability, fracture toughness and thermal conductivity