Experimental Study of Improved Nano-imprint Process by using SU-8 3000NIL Resist

Ono, Toshiyuki; Honda, Nao; Mori, Satoshi; Kono, Yoshiki; Sekiguchi, Atsushi

doi:10.2494/photopolymer.19.393

Cited by 2 publications

(2 citation statements)

References 2 publications

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“…Furthermore, these resists can only be cross-linked by UV light, so a transparent mold or substrate is required. On the other hand, epoxy-based negative photoresist, such as SU-8, was used for combined UV and thermal NIL, but it required very high imprint pressure (as high as 30 bar) to press the mold into the molten resist [ 21 - 23 ].…”

Section: Introductionmentioning

confidence: 99%

A fast thermal-curing nanoimprint resist based on cationic polymerizable epoxysiloxane

Zhang

et al. 2012

Nanoscale Res Lett

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We synthesized a series of epoxysiloxane oligomers with controllable viscosity and polarity and developed upon them a thermal-curable nanoimprint resist that was cross-linked in air at 110°C within 30 s if preexposed to UV light. The oligomers were designed and synthesized via hydrosilylation of 4-vinyl-cyclohexane-1,2-epoxide with poly(methylhydrosiloxane) with tunable viscosity, polarity, and cross-linking density. The resist exhibits excellent chemical and physical properties such as insensitivity toward oxygen, strong mechanical strength, and high etching resistance. Using this resist, nanoscale patterns of different geometries with feature sizes as small as 30 nm were fabricated via a nanoimprint process based on UV-assisted thermal curing. The curing time for the resist was on the order of 10 s at a moderate temperature with the help of UV light preexposure. This fast thermal curing speed was attributed to the large number of active cations generated upon UV exposure that facilitated the thermal polymerization process.

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Section: Introductionmentioning

confidence: 99%

A fast thermal-curing nanoimprint resist based on cationic polymerizable epoxysiloxane

Zhang

et al. 2012

Nanoscale Res Lett

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“…Recently, UV imprinting of SU-8 has been studied by several research groups owing to its potential to produce nanostructures with high throughput at a low cost. [4][5][6][7][8] The UV imprinting process enables the fabrication of nanostructures on permanent-use UV-curable resists at close to room temperature under low pressure, thereby enabling a high layer-to-layer overlay accuracy and a low thermal residual stress.…”

Section: Introductionmentioning

confidence: 99%

Microstructuring of 45-µm-Deep Dual Damascene Openings in SU-8/Si by UV-Assisted Thermal Imprinting with Opaque Mold

Youn

Ueno

Takahashi

et al. 2009

jjap

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Explicit expressions are derived for the macroscopic and the internal strain in the crystalsofthediamondstruchlre with (0Ol)surfacessubjeci toastresapplied from the sides parallel to the (001) direction. The numerical predictions of the surface relaxation at the ideal (001) surfaces of C, Si, Ge and a-Sn crystals are given in tenus of the valence force constants already used for the description of the dynamics of the materials. The results are compared with the existing experimental observations.

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Experimental Study of Improved Nano-imprint Process by using SU-8 3000NIL Resist

Cited by 2 publications

References 2 publications

A fast thermal-curing nanoimprint resist based on cationic polymerizable epoxysiloxane

A fast thermal-curing nanoimprint resist based on cationic polymerizable epoxysiloxane

Microstructuring of 45-µm-Deep Dual Damascene Openings in SU-8/Si by UV-Assisted Thermal Imprinting with Opaque Mold

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