Experimental study of flow boiling in a compact hierarchical manifold microchannel heat sink array

Drummond, Kevin P.; Weibel, Justin A.; Garimella, Suresh V.

doi:10.1109/semi-therm.2017.7896921

Cited by 4 publications

(3 citation statements)

References 8 publications

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“…According to the dynamic pressure test results, the pressure pulsation amplitude of pressure-drop type instability may reach 160 kPa with a frequency of less than 3 Hz, which may easily cause pipeline resonance. With significant advantages such as strong heat transfer capacity, compact structure, and easy integration, micro-channel flow boiling is promising in the thermal management of high heat flux electronic devices [20,21]. However, the applications of two-phase flow are limited due to its instability.…”

Section: Introductionmentioning

confidence: 99%

Experimental Study on the Heat Transfer Performance of Pump-Assisted Capillary Phase-Change Loop

et al. 2021

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To overcome the two-phase flow instability of traditional boiling heat dissipation technologies, a porous wick was used for liquid-vapor isolation, achieving efficient and stable boiling heat dissipation. A pump-assisted capillary phase-change loop with methanol as the working medium was established to study the effect of liquid-vapor pressure difference and heating power on its start-up and steady-state characteristics. The results indicated that the evaporator undergoes four heat transfer modes, including flooded, partially flooded, thin-film evaporation, and overheating. The thin-film evaporation mode was the most efficient with the shortest start-up period. In addition, heat transfer modes were determined by the liquid-vapor pressure difference and power. The heat transfer coefficient significantly improved and the thermal resistance was reduced by increasing liquid-vapor pressure as long as it did not exceed 8 kPa. However, when the liquid-vapor pressure exceeded 8 kPa, its influence on the heat transfer coefficient weakened. In addition, a two-dimensional heat transfer mode distribution diagram concerning both liquid-vapor pressure difference and power was drawn after a large number of experiments. During an engineering application, the liquid-vapor pressure difference can be controlled to maintain efficient thin-film evaporation in order to achieve the optimum heat dissipation effect.

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Section: Introductionmentioning

confidence: 99%

Experimental Study on the Heat Transfer Performance of Pump-Assisted Capillary Phase-Change Loop

et al. 2021

View full text Add to dashboard Cite

show abstract

“…According to the dynamic pressure test results, the pressure pulsation amplitude of pressure drop type instability may reach 160 kPa with frequency less 3 Hz, which may easily cause pipeline resonance. With significant advantages such as strong heat transfer capacity, compact structure and easy integration, the micro-channel flow boiling is very promising in the field of thermal management of high heat flux electronic devices [16,17]. However, as a matter of fact, the application of two-phase flow is limited due to its instability.…”

Section: Introductionmentioning

confidence: 99%

Experimental Study on the Heat Transfer Performance of Pump-assisted Capillary Phase-change Loop

Yang¹,

Wang²,

Zhang³

et al. 2021

Preprint

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To overcome the two-phase flow instability of traditional boiling heat dissipation technologies, a porous wick was used for liquid-vapor isolation, thus realizing efficient and stable boiling heat dissipation. A pump-assisted capillary phase-change loop with methanol as working medium was established to study the effect of liquid-vapor pressure difference and heating power on its start-up and steady-state characteristics. The results indicated that the evaporator undergoes four heat transfer modes including flooded, partial flooded, thin film evaporation and overheating. The thin film evaporation mode was the most efficient one with the shortest start-up period. Besides, the heat transfer modes were determined by liquid-vapor pressure difference and power. The heat transfer coefficient could be significantly improved and the thermal resistance could be reduced by increasing liquid-vapor pressure difference as long as it did not exceed 8 kPa. However, when the liquid-vapor pressure difference exceeded 8kPa, its influence on the heat transfer coefficient weakened. In addition, a two-dimensional heat transfer mode distribution diagram considering both liquid-vapor pressure difference and power was drawn through a great number of experiments. During engineering application, the liquid-vapor pressure difference can be controlled to maintain efficient thin film evaporation in order to achieve the optimum heat dissipation effect.

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“…After that, various researches on microchannel heat sink have been studied both numerically and experimentally including pin fin geometry [4][5][6], inlet/outlet layout [7,8] and multi-layer structures [9][10][11]. Except for the microstructure and micro-heat sink layout, flow boiling [12,13] and nanofluids cooling [14,15] were also found related to improving heat transfer capability. Owing to the mature technology in semiconductor fabrications, these microcooling researches were mainly applied on silicon substrate microchannels.…”

Section: Introductionmentioning

confidence: 99%

Microembossed copper microchannel heat sink for high‐density cooling in electronics

Chen

2019

Micro & Nano Letters

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A microembossed copper microchannel heat sink was designed and fabricated for high-density cooling in electronics. The microchannel width and aspect ratio were investigated to find out the optimised channel size for microembossing. The fabrication method was based on bulk copper forming including tungsten die inductively coupled plasma etching, hot copper microembossing, inlet/outlet ports punching and sealing. The heat dissipation performances were tested by ceramic heater. The maximum temperature decreased to ∼37°C under different heat fluxes, with the maximum temperature decreased by 69.2% at 50 W/cm 2 heat flux. The equivalent heat transfer coefficient reached the value of 6492 W/m 2 K. High-power chip was used as heat source too. The maximum heat flux reached 304.8 W/cm 2 when the chip can still function properly at 90.5°C. High cooling performance with the micro-heat sink proves that microembossing by tungsten die is an alternative process for microchannel heat sink fabrication with batch production and low cost. Taking advantages of simple fabrication process and reutilisation of tungsten die, the technology shows promising potentials in high-density microcooling systems.

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Experimental study of flow boiling in a compact hierarchical manifold microchannel heat sink array

Cited by 4 publications

References 8 publications

Experimental Study on the Heat Transfer Performance of Pump-Assisted Capillary Phase-Change Loop

Experimental Study on the Heat Transfer Performance of Pump-Assisted Capillary Phase-Change Loop

Experimental Study on the Heat Transfer Performance of Pump-assisted Capillary Phase-change Loop

Microembossed copper microchannel heat sink for high‐density cooling in electronics

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