Experimental Study of a High Performance Aligned Graphite Thermal Interface Material

Thermal management technology plays a key role in the continuing miniaturization, performance improvements, and higher reliability of electronic systems. For the past decade, and particularly, the past 4 years, the Defense Advanced Research Projects Agency (DARPA) has aggressively pursued the application of micro-and nano-technology to reduce or remove thermal constraints on the performance of defense electronic systems. The DARPA Thermal Management Technologies (TMT) portfolio is comprised of five technical thrust areas: Thermal Ground Plane (TGP), Microtechnologies for Air-Cooled Exchangers (MACE), NanoThermal Interfaces (NTI), Active Cooling Modules (ACM), and Near Junction Thermal Transport (NJTT). An overview of the TMT program will be presented with emphasis on the goals and status of these efforts relative to the current State-of-the-Art. The presentation will close with future challenges and opportunities in the thermal management of defense electronics.

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“…A selected bibliography of NTI team publications is included in this paper [31][32][33][34][35][36][37].…”

Section: Nano Thermal Interfaces (Nti)mentioning

confidence: 99%

Advanced thermal management technologies for defense electronics

Bloschock

Bar‐Cohen

2012

SPIE Proceedings

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“…The GLAD copper springs (GE) and graphite-solder laminated structures (Teledyne) showed the lowest resistivities and are currently undergoing aging and temperature cycling tests to establish their robustness and durability. A selected bibliography of NTI team publications is included in this paper [37][38][39][40][41][42][43][44].…”

Section: Nano Thermal Interfaces (Nti)mentioning

confidence: 99%

Towards Embedded Cooling - Gen 3 Thermal Packaging Technology

Bar‐Cohen

2014

Encyclopedia of Thermal Packaging

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From the dawn of the Information Age thermal management technology has played a key role in the continuing miniaturization, performance improvements, and higher reliability of electronic systems. During the past 65 years, thermal packaging has migrated from ventilation and air-conditioning to cabinet cooling, to package cooling with heat sinks and cold plates, and is today addressing on-chip hot spots and near-junction thermal transport. Following a brief history of thermal packaging, attention will turn to a review of emerging micro and nano-technologies for reducing the thermal resistance of defense electronic systems. The asymptotic maturation of current technology and growing thermal management demands in high performance computing and RF systems have led DARPA to initiate efforts in third-generation "embedded" thermal management technology based on intrachip and interchip microfluidic cooling. The motivation, technological thrusts, and promise of this new thermal management paradigm will be discussed.

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“…(Zhao et al, 2012;Zhao et al, 2011) prototyped a new TIM structure: vertically-aligned graphite laminated with solder layers (Fig. 1).…”

Section: Frontiers In Heat and Mass Transfermentioning

confidence: 99%

“…Tin metallization was completed by electroplating technique. The detail fabrication processes were discussed in the previous publication (Zhao et al, 2012;Zhao et al, 2011). Our target temperature range is focused between 25°C and lower than 200°C.…”

Section: Tim Sample Preparationmentioning

confidence: 99%

Experimental Study of Coefficient of Thermal Expansion of Aligned Graphite Thermal Interface Materials

Chen¹,

Yuan²,

Chen³

2013

Frontiers in Heat and Mass Transfer

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Carbon-based materials draw more and more attention from both academia and industry: its allotropes, including graphene nanoplatlets, graphite nanoplatlets and carbon nanotubes, can readily enhance thermal conductivity of thermal interface products when served as fillers. Structuraloptimization in micro/nano-scale has been investigated and expected to finely tune the coefficient of thermal expansion (CTE) of thermal interface materials (TIMs). The capability of adjusting CTE of materials greatly benefits the design of interface materials as CTE mismatch between materials may result in serious fatigue at the interface region that goes through thermal cycles. Recently, a novel nano-thermal-interface material has been developed, which is composed of tin (Sn) solder and graphite nanoplatlets. CTE of such sort of TIMs can be adjusted to match well with the substrate materials. A customized, optical CTE measuring system was built to measure CTEs of these thin and flexible samples. The averaged CTEs of samples made by this new approach range from -0.267×10 -6 /°C to 5×10 -6/°C between 25°C and 137°C, which matches CTEs of typical semiconductor materials (the CTE of silicon is ~3×10 -6 /°C in the same temperature range). This unique CTE-matching feature of a bonding material will have great potential to impact future development of high power microelectronics devices.

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Experimental Study of a High Performance Aligned Graphite Thermal Interface Material

Cited by 7 publications

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Advanced thermal management technologies for defense electronics

Advanced thermal management technologies for defense electronics

Towards Embedded Cooling - Gen 3 Thermal Packaging Technology

Experimental Study of Coefficient of Thermal Expansion of Aligned Graphite Thermal Interface Materials

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