Advanced thermal management technologies for defense electronics

Bloschock, Kristen P.; Bar‐Cohen, Avram

doi:10.1117/12.924349

Cited by 42 publications

(18 citation statements)

References 34 publications

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“…Flux Two-Phase Cooling of Electronics 1 Kevin P. Drummond (a,c) , Doosan Back (b,c) , Michael D. Sinanis (b,c) , David B. Janes (b,c) , Dimitrios Peroulis (b,c) , Justin A. Weibel (a,c) , and Suresh V. Garimella Purdue University, West Lafayette, Indiana 47907 USA Abstract: High-heat-flux removal is necessary for next-generation microelectronic systems to operate more reliably and efficiently. Extremely high heat removal rates are achieved in this work using a hierarchical manifold microchannel heat sink array.…”

Section: A Hierarchical Manifold Microchannel Heat Sink Array For Higmentioning

confidence: 99%

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A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics

Drummond

Back

Sinanis

et al. 2018

International Journal of Heat and Mass Transfer

267

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High-heat-flux removal is necessary for next-generation microelectronic systems to operate more reliably and efficiently. Extremely high heat removal rates are achieved in this work using a hierarchical manifold microchannel heat sink array. The microchannels are imbedded directly into the heated substrate to reduce the parasitic thermal resistances due to contact and conduction resistances. Discretizing the chip footprint area into multiple smaller heat sink elements with high-aspect-ratio microchannels ensures shortened effective fluid flow lengths. Phase change of high fluid mass fluxes can thus be accommodated in micron-scale channels while keeping pressure drops low compared to traditional, microchannel heat sinks.A thermal test vehicle, with all flow distribution components heterogeneously integrated, is fabricated to

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Section: A Hierarchical Manifold Microchannel Heat Sink Array For Higmentioning

confidence: 99%

“…For example, heat fluxes in excess of 1000 W/cm² must be dissipated in next-generation radar, power electronics, and high-performance computing systems [1,2]. Electronic devices have traditionally been cooled through the attachment of standalone heat sinks.…”

Section: Introductionmentioning

confidence: 99%

A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics

Drummond

Back

Sinanis

et al. 2018

International Journal of Heat and Mass Transfer

267

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“…The HERETIC program covered a broad spectrum of thermal management techniques, and included jet-impingement cooling, thermoelectrics, MEMS-based approaches, and thermoacoustic cooling, among others, see, for example, [10][11][12][13][14][15][16]. HERETIC and THREADS, which was focused on device-scale thermal management, were followed by the Thermal Management Technologies Program (TMT), launched in 2008 and targeted at using micro-nano materials and transport processes to reduce the individual, as well as the overall, thermal resistances in the prevailing "attached microcooler" paradigm [17]. The Near Junction Thermal Transport(NJTT) program started in 2012 and the Inter-Intra Chip Enhanced Cooling (ICECool) program in 2013 [18] represent a significant departure from Commercial-Off-the-Shelf technology and will be discussed in a later section.…”

Section: Micro-nano Materials and Structures For Thermal Managementmentioning

confidence: 99%

Towards Embedded Cooling - Gen 3 Thermal Packaging Technology

Bar‐Cohen

2014

Encyclopedia of Thermal Packaging

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From the dawn of the Information Age thermal management technology has played a key role in the continuing miniaturization, performance improvements, and higher reliability of electronic systems. During the past 65 years, thermal packaging has migrated from ventilation and air-conditioning to cabinet cooling, to package cooling with heat sinks and cold plates, and is today addressing on-chip hot spots and near-junction thermal transport. Following a brief history of thermal packaging, attention will turn to a review of emerging micro and nano-technologies for reducing the thermal resistance of defense electronic systems. The asymptotic maturation of current technology and growing thermal management demands in high performance computing and RF systems have led DARPA to initiate efforts in third-generation "embedded" thermal management technology based on intrachip and interchip microfluidic cooling. The motivation, technological thrusts, and promise of this new thermal management paradigm will be discussed.

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“…Integral liquid cooling, where the on-chip heat generation sites are cooled directly to extract the dissipated heat with microfluidic flow through the chip or package, could overcome these limitations. [1] [2] The first design for microchannel heat sinks was proposed by Tuckerman and Pease [3], and consisted of microchannels running parallel to a heat-base. Since then, this conventional configuration has been further investigated [4] and significant efforts have been made to enhance the design [5].…”

Section: Introductionmentioning

confidence: 99%

Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics

Scholl

Gorlé

Houshmand

et al. 2015

Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging

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This study considers CFD simulations with conjugate heat transfer performed in the framework of designing a complex micro-scale cooling geometry. The numerical investigation of the three-dimensional, laminar flow (Reynolds number smaller than 480) and the solid conduction is done on a reduced model of the heat sink micro-structure to enable exploring a variety of configurations at a limited computational cost. The reduced model represents a unit-cell, and uses periodic and symmetry boundary conditions to mimic the conditions in the entire cooling manifold. A simulation of the entire heat sink micro-structure was performed to verify the unit-cell set-up, and the comparison demonstrated that the unit-cell simulations allow reducing the computational cost by two orders of magnitude while retaining accurate results. The baseline design for the unit-cell represents a configuration used in traditional electronic heat sinks, i.e. a simple channel geometry with a rectangular cross section, with a diameter of 50 μm, where the fluid flows between two cooling fins. Subsequently three types of modified geometries with feature sizes of 50 μm were considered: baffled geometries that guide the flow towards the hotspot region, geometries where the fins are connected by crossbars, and a woodpile structure without cooling fins. Three different mass-flow rates were tested. Based on the medium mass-flow rate considered, the woodpile geometry showed the highest heat transfer coefficient with an increase of 70% compared to the baseline geometry, but at the cost of increasing the pressure drop by more than 300%. The crossbar geometries were shown to be promising configurations, with increases in the heat transfer coefficient of more than 20% for a 70% increase in pressure drop. The potential for further optimization of the crossbar configurations by adding or removing individual crossbars will be investigated in a follow up study. The results presented demonstrate the increase in performance that can be obtained by investigating a variety of designs for single phase cooling devices using unit-cell conjugate heat transfer simulations.

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Advanced thermal management technologies for defense electronics

Cited by 42 publications

References 34 publications

A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics

A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics

Towards Embedded Cooling - Gen 3 Thermal Packaging Technology

Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics

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