Experimental research on the longitudinal coupling impedance of RF-shielded BPM-bellows assemblies designed for the Hefei Advanced Light Facility

Bian, Baoyuan; Hong, Yongtaek; Wang, Sihui; Fan, Liancheng; Zhu, Bangle; Fang, Jianwei; Zhang, Wenli; Wang, Yong

doi:10.1016/j.nima.2022.167450

Cited by 1 publication

(1 citation statement)

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“…Typically, the crotch absorbers, installed at pump stations, block most of the heat load and allow parts of SR to be sent to the beamline for scientific research and applications [3][4][5]. However, some BM radiation, skipping the crotch absorbers, can hit the vacuum chambers and delicate vacuum components, i.e., RF-shielded BPM-bellows assembly [6]. Therefore, a photon block should be placed in the BPM-bellows front-end to absorb these BM radiations.…”

Section: Introductionmentioning

confidence: 99%

Design and thermal analysis of the BPM-bellows assembly front-end photon block for Hefei Advanced Light Facility

Bian,

Wang,

Hong

et al. 2023

J. Inst.

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The BPM-bellows front-end photon block with ellipse cross-sections has been designed for Hefei Advanced Light Facility (HALF). Such structure has lower longitudinal coupling impedances than the photon block with commonly-used circle cross-sections. In addition, two types of cooling structures have been designed, which are shared water-cooling pipe (cooling structure 1, CS1) and independent water-cooling tank (cooling structure 1, CS2), respectively. The CS1 is simple and space-saving, while the CS2 has better heat dissipation capability. In order to calculate power density on complex light-receiving surfaces, the Monte Carlo simulation tool, Synrad, was applied. By building finite element models and importing power density data from Syrand, the temperature and thermal stress distributions of photon blocks with two different cooling structures were calculated. The thermal analysis indicates that the maximum temperature (37.73°C) is located at CS1, but the maximum stress (16.28 MPa) is on CS2 due to the difference in structure and heat dissipation capability. Moreover, the maximum temperature and thermal stress values are far below the material criteria of CuCrZr. Therefore, the simple and space-saving CS1 is more suitable for HALF, which can reduce manufacturing costs and better satisfy the compact layout in the storage ring.

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Section: Introductionmentioning

confidence: 99%