Experimental Research on Cutting of Silicon with Fixed Diamond Wire Saw

Zhao, Li; Zuo, Dun Wen; Sun, Yixuan; Wang, Min

doi:10.4028/www.scientific.net/kem.431-432.25

Cited by 3 publications

(4 citation statements)

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…When the linear speed is higher, the surface roughness of the slice is smaller. They are inversely proportional, which is consistent with the experimental results (Zhao et al , 2010).…”

Section: Simulation Results and Experimental Analysissupporting

confidence: 92%

See 1 more Smart Citation

Three-dimensional topography simulation research of diamond-wire sawing based on MATLAB

Ligang

Xia

Shi

et al. 2019

ILT

View full text Add to dashboard Cite

Purpose The purpose of this paper is to study the influence of the processing parameters of diamond wire sawing on surface morphology and roughness. Design/methodology/approach First, a wire saw cutting model is established to determine the positional relationship between a wire saw and the machined surface of the workpiece, and the abrasive grain cutting trajectory is generated. Through the data processing of the cutting trajectory, the simulation of the three-dimensional surface topography of the slice and the calculation of the surface roughness are realized by using the GUI programming of MATLAB. Finally, different surface roughness values are obtained by changing the machining parameters (saw wire speed and workpiece feed speed). Findings The conclusion is that the surface roughness of the slice is larger when the feed speed is higher and smaller when the linear speed is higher. Originality/value Diamond wire saw cutting is the first process of chip processing, and its efficiency and quality have an important impact on subsequent processing. This paper will focus on the influence of the sawing wire cutting processing parameters (sawing wire speed and workpiece feed speed) on the surface roughness to optimize the processing parameters and obtain smaller surface roughness values. Through MATLAB three-dimensional simulation, the surface morphology can be observed more intuitively, which provides a theoretical basis for improving the processing quality.

show abstract

“…When the linear speed is higher, the surface roughness of the slice is smaller. They are inversely proportional, which is consistent with the experimental results (Zhao et al , 2010).…”

Section: Simulation Results and Experimental Analysissupporting

confidence: 92%

“…When the feed speed is higher, the surface roughness of the slice is larger. The two are proportional to each other, which is consistent with the conclusions drawn from the experiment (Zhao et al , 2010).…”

Section: Simulation Results and Experimental Analysissupporting

confidence: 91%

Three-dimensional topography simulation research of diamond-wire sawing based on MATLAB

Ligang

Xia

Shi

et al. 2019

ILT

View full text Add to dashboard Cite

show abstract

“…When the feed speed is higher, the surface roughness of the slice is larger. The influence law is same to the processing experiments [2]. The simulation results are smaller than the experiments because of the simplification.…”

Section: The Influence Law Of Surface Roughness Affected By the Feedimentioning

confidence: 99%

“…The slicing is an important step and the first process of the crystal ingot becomes chip, which has an important impact on the subsequent processing because of its efficiency and quality [1,2]. What determine the grinding removal amount are the incisions, damage, breakage which caused by mechanical action in the slicing process.…”

Section: Introductionmentioning

confidence: 99%

Three-dimensional Topography Simulation Research of Diamond-wire Sawing Based on Matlab

Ligang¹,

Ruan²,

Xiao-yan³

et al. 2017

dtmse

View full text Add to dashboard Cite

Abstract. The influence law of the surface topography and roughness by processing parameters of diamond wire-saw slicing simulation is researched in this paper. At First, the wire saw slicing model is built. The position relation between the wire saw and the machining surface is definite in the model. The motion trajectory of the diamond abrasive on the wire saw is generated. Processing the motion trajectory of the diamond abrasives and the 3D topography of the slicing surface is generated. According to the 3D topography and the roughness formula, the surface roughness can be calculated. Finally, by changing machining parameters, such as wire saw linear velocity and workpiece feed velocity, the corresponding surface roughness will be obtained. Therefore, the influence law of wire saw linear velocity and workpiece feed velocity on the surface roughness is studied. The influence law provides a theoretical basis to improve the quality of wire saw slicing. IntroductionFixed abrasive diamond wire slicing technology is mainly used for cutting hard and brittle materials, especially semiconductor ceramic material cutting, such as monocrystalline silicon, polycrystalline silicon, gallium arsenide slices. The slicing is an important step and the first process of the crystal ingot becomes chip, which has an important impact on the subsequent processing because of its efficiency and quality [1,2]. What determine the grinding removal amount are the incisions, damage, breakage which caused by mechanical action in the slicing process. And the slicing of monocrystalline silicon, gallium arsenide crystals and other precious materials technology to reach requirements of the small surface roughness and damage layer as shallow as possible. The problems of minimizing the workload of the subsequent processing is how to slice silicon and gallium arsenide crystal in the efficient, high-precision, high-quality, low-damage way. To get smaller surface roughness value, this article will focus on the influential law of wire saw cutting machining parameters, wire saw linear speed and workpiece feeding speed, on the surface roughness and optimizing processing parameters.

show abstract

Finite element analysis of multi-wire saw silicon rods with consolidated abrasive diamonds

Jiang

Fan

et al. 2016

Int J Adv Manuf Technol

View full text Add to dashboard Cite

Experimental Research on Cutting of Silicon with Fixed Diamond Wire Saw

Cited by 3 publications

References 4 publications

Three-dimensional topography simulation research of diamond-wire sawing based on MATLAB

Three-dimensional topography simulation research of diamond-wire sawing based on MATLAB

Three-dimensional Topography Simulation Research of Diamond-wire Sawing Based on Matlab

Finite element analysis of multi-wire saw silicon rods with consolidated abrasive diamonds

Contact Info

Product

Resources

About