Three-dimensional Topography Simulation Research of Diamond-wire Sawing Based on Matlab

Abstract

Abstract. The influence law of the surface topography and roughness by processing parameters of diamond wire-saw slicing simulation is researched in this paper. At First, the wire saw slicing model is built. The position relation between the wire saw and the machining surface is definite in the model. The motion trajectory of the diamond abrasive on the wire saw is generated. Processing the motion trajectory of the diamond abrasives and the 3D topography of the slicing surface is generated. According to the 3D topography and the roughness formula, the surface roughness can be calculated. Finally, by changing machining parameters, such as wire saw linear velocity and workpiece feed velocity, the corresponding surface roughness will be obtained. Therefore, the influence law of wire saw linear velocity and workpiece feed velocity on the surface roughness is studied. The influence law provides a theoretical basis to improve the quality of wire saw slicing. IntroductionFixed abrasive diamond wire slicing technology is mainly used for cutting hard and brittle materials, especially semiconductor ceramic material cutting, such as monocrystalline silicon, polycrystalline silicon, gallium arsenide slices. The slicing is an important step and the first process of the crystal ingot becomes chip, which has an important impact on the subsequent processing because of its efficiency and quality [1,2]. What determine the grinding removal amount are the incisions, damage, breakage which caused by mechanical action in the slicing process. And the slicing of monocrystalline silicon, gallium arsenide crystals and other precious materials technology to reach requirements of the small surface roughness and damage layer as shallow as possible. The problems of minimizing the workload of the subsequent processing is how to slice silicon and gallium arsenide crystal in the efficient, high-precision, high-quality, low-damage way. To get smaller surface roughness value, this article will focus on the influential law of wire saw cutting machining parameters, wire saw linear speed and workpiece feeding speed, on the surface roughness and optimizing processing parameters.