2016
DOI: 10.1016/j.applthermaleng.2015.12.080
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Experimental investigations of a latent heat energy storage unit using finned tubes

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Cited by 61 publications
(34 citation statements)
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“…[9][10][11][12] Methods for LHS performance enhancement include extending heat transfer surface, [13][14][15][16][17][18][19] improving process uniformity 7,20 and enhancing PCM conductivity. [9][10][11][12] Methods for LHS performance enhancement include extending heat transfer surface, [13][14][15][16][17][18][19] improving process uniformity 7,20 and enhancing PCM conductivity.…”
Section: Introductionmentioning
confidence: 99%
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“…[9][10][11][12] Methods for LHS performance enhancement include extending heat transfer surface, [13][14][15][16][17][18][19] improving process uniformity 7,20 and enhancing PCM conductivity. [9][10][11][12] Methods for LHS performance enhancement include extending heat transfer surface, [13][14][15][16][17][18][19] improving process uniformity 7,20 and enhancing PCM conductivity.…”
Section: Introductionmentioning
confidence: 99%
“…In order to improve the performance of latent heat storage systems, researchers have conducted a large number of studies. [9][10][11][12] Methods for LHS performance enhancement include extending heat transfer surface, [13][14][15][16][17][18][19] improving process uniformity 7,20 and enhancing PCM conductivity. [21][22][23][24][25][26][27][28][29] Lohrasbi et al 13 and Kabbara et al 14 used axially fins and radially fins, respectively, to extend the heat transfer surface area.…”
mentioning
confidence: 99%
“…The theoretical amount of total energy of which a specified mass of PCM can store has been established and commonly used in previous studies [4,7,32,33,34]; it will be presented in Chapter 3. The rate at which this energy is stored is not as simple to determine.…”
Section: The Rate Problemmentioning
confidence: 99%
“…The heat transfer rate is dependent on multiple factors such as thermal conductivity of the PCM, geometry of the encapsulation, the temperature of the HTF, the flow rate of the HTF and the initial temperature of the PCM, as well as the nature and strength of the various heat transfer processes in the PCM (conduction, natural convection), etc. [7,14,16,31,33,34,35]. Thus, various PCM TES applications will charge and discharge at different rates necessitating the need for characterizing the heat transfer rates of each system individually since no simple heat exchanger design rule currently exist for PCM heat exchanger.…”
Section: The Rate Problemmentioning
confidence: 99%
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