Experimental characterization of a curing thermoset epoxy‐anhydride system—Isothermal and nonisothermal cure kinetics

Huang, Xiaosong; Patham, Bhaskar

doi:10.1002/app.37567

Cited by 32 publications

(20 citation statements)

References 26 publications

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“…This, on one side, makes the model quite complex, on the other side is logically suspicious even if mathematically right. In earlier studies, the average values from the developed data sets from each cure curves are taken as a general model . However, the model based on the average value seems to predict the curing behavior poorly, as shown in Figures and .…”

Section: Resultsmentioning

confidence: 99%

“…Moreover, Kissinger method simplifies the activation energy and pre‐exponential factor as being a constant value during the whole reaction, which possible could be an over‐simplification for complex reactions. However, this method is applied in many studies for kinetic analysis of epoxy systems and reported to be a feasible estimation of the model starting parameter …”

Section: Theoriotical Backgroundmentioning

confidence: 99%

“…The development of the model coefficients is based on linear or non‐linear the least‐square regression analysis—the regression analysis tries to find the optimal coefficients for the models by which the summed square of residuals between the test value and model value. The analysis could be described mathematically as follows:

S_{r} = \sum_{i = 1}^{n} r_{i}^{2} = \sum_{i = 1}^{n} true(f (|, X normald normala normalt a_{i}, Ψ) - Y normald normala normalt a_{i})^{2}

…”

Section: Theoriotical Backgroundmentioning

confidence: 99%

“…Therefore, phenomenological models are much simpler to develop and mostly could also accurately describe and predict the kinetic behavior, which is the reason why it is more preferable in the practice. Several studies are conducted on curing kinetics and rheological modeling and of epoxy resin systems, among which mostly phenomenological models are preferred due to its simplicity to develop and nevertheless good ability to describe the curing/rheological behavior . The modeling of the curing and rheological behavior by the phenomenological models is based on selection of representing reaction models, estimation of start parameters and evaluation of final model parameters.…”

Section: Introductionmentioning

confidence: 99%

“…Even if in several studies the similar or the same epoxy resin systems are investigated, quite different model parameters are reported depending on the methods that are applied for model estimation and regression algorithm. For instance, Huang et al . modelled dynamic and isothermal curing of an epoxy/anhydride system by an nonlinear regression analysis by applying different models and reported process and temperature dependent models for the same system by the different modeling methods.…”

Section: Introductionmentioning

confidence: 99%

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Influence of model parameter estimation methods and regression algorithms on curing kinetics and rheological modelling

Abliz

Artys

Ziegmann

2017

J of Applied Polymer Sci

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The accuracy of the phenomenological curing and rheological models are strongly related to the estimated start parameters and selected regression algorithms. Considering the versatile methods for model start parameter estimation (model‐free vs. model‐fitting, dynamic vs. isothermal) and regression analysis algorithm (linear vs. nonlinear, single‐target vs. multi‐target), this paper investigates the theoretical basis and influence of these aspects on the model development process and model quality. The curing kinetics is modelled by model‐free and model‐fitting start parameters and different regression algorithms, followed by cross model validation at the final. The results showed that the different parameter estimation methods and evaluation algorithms have a remarkable influence on the final model parameters and its quality. The study shows the correlation between the different aspects and provides a basis for better selection of model parameter evaluation methods and regression algorithms for model development with improved quality and accuracy. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017, 134, 45137.

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Section: Resultsmentioning

confidence: 99%

Section: Theoriotical Backgroundmentioning

confidence: 99%

S_{r} = \sum_{i = 1}^{n} r_{i}^{2} = \sum_{i = 1}^{n} true(f (|, X normald normala normalt a_{i}, Ψ) - Y normald normala normalt a_{i})^{2}

…”

Section: Theoriotical Backgroundmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Influence of model parameter estimation methods and regression algorithms on curing kinetics and rheological modelling

Abliz

Artys

Ziegmann

2017

J of Applied Polymer Sci

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Spectral and Thermal Behavior of Aromatic and Aliphatic Amines Cured Cardo Group Containing Multifunctional Epoxy Resin

Patel

Parsania

2013

Adv Polym Technol

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Multifunctional cardo epoxy resin (EBCF) was cured by using 3,3 -diaminodiphenylsulfone, 4,4 -diaminodiphenylsulfone, 4,4 -diaminodiphenyl ether, 4,4 -diaminodiphenylmethane, 1,4-phenylenediamine, triethylamine, and diethylenetriamine as hardeners at 120 • C for 15-60 min (gel time), and were post cured at 140 • C for 80-90 min. Cured samples were found insoluble in common solvents. Cured and uncured EBCF are characterized by infrared spectral, differential scanning calorimetry, and thermogravimetric analysis techniques. Kinetic parameters, namely order of degradation, energy of activation, frequency factor, and entropy change were determined according to Anderson-Freeman method and interpreted in the light of nature of hardeners used. Thermal data of cured and uncured EBCF revealed complex degradation kinetics. C

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Modeling the curing kinetics of two thermoset adhesives under varying temperature conditions

Zhang,

Liu,

Xia

et al. 2023

J of Applied Polymer Sci

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This paper presents detailed curing kinetics models for two thermoset adhesives. The cure kinetics were characterized using differential scanning calorimetry in both anisothermal and isothermal modes. The Sestak–Berggren autocatalytic model was applied to describe the anisothermal cure kinetics of the two adhesives with the Malek and undetermined coefficients methods determining their kinetic parameters. The Kamal autocatalytic model was adopted for the isothermal curing processes with the Kenny analytical‐graphical method determining the kinetic parameters. A modified Kamal model was developed by introducing a concept of the maximum degree of cure (DOC) and temperature‐depended kinetic parameters to describe the isothermal cure kinetics of the adhesive with a typical exothermic peak, and an extended Kamal model was further proposed by adding an initial‐phase‐control term to the modified Kamal model to describe the isothermal cure kinetics of the adhesive with two exothermic peaks. The results showed that the presented curing kinetics models with the determined parameters can precisely predict the evolutions of the DOC of the two thermoset adhesives in both anisothermal and isothermal modes.

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Experimental characterization of a curing thermoset epoxy‐anhydride system—Isothermal and nonisothermal cure kinetics

Cited by 32 publications

References 26 publications

Influence of model parameter estimation methods and regression algorithms on curing kinetics and rheological modelling

Influence of model parameter estimation methods and regression algorithms on curing kinetics and rheological modelling

Spectral and Thermal Behavior of Aromatic and Aliphatic Amines Cured Cardo Group Containing Multifunctional Epoxy Resin

Modeling the curing kinetics of two thermoset adhesives under varying temperature conditions

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