Modeling the curing kinetics of two thermoset adhesives under varying temperature conditions
Xiumin Zhang,
Jianhua Liu,
Huanxiong Xia
et al.
Abstract:This paper presents detailed curing kinetics models for two thermoset adhesives. The cure kinetics were characterized using differential scanning calorimetry in both anisothermal and isothermal modes. The Sestak–Berggren autocatalytic model was applied to describe the anisothermal cure kinetics of the two adhesives with the Malek and undetermined coefficients methods determining their kinetic parameters. The Kamal autocatalytic model was adopted for the isothermal curing processes with the Kenny analytical‐gra… Show more
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