Experimental based finite element simulation of cold isostatic pressing of metal powders

Szanto, M.; Bier, Wolfgang; Frage, N.; Hartmann, Stefan; Yosibash, Zohar

doi:10.1016/j.ijmecsci.2007.10.004

Cited by 18 publications

(9 citation statements)

References 16 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…Cold isostatic pressing (CIP) has been widely used to compress and mold metal, ceramic, plastic, or composite powders into a certain form 20 21 22 . Recently, an improvement in the mechanical characteristics and a 2000 times increase in hole mobility were achieved using CIP treatment of vacuum-deposited metal-free phthalocyanine (H 2 PC) layers with a 200 MPa pressure because the spatial gaps were crushed between H 2 PC grains 23 24 .…”

mentioning

confidence: 99%

Vacuum-and-solvent-free fabrication of organic semiconductor layers for field-effect transistors

Matsushima

Sandanayaka

Esaki

et al. 2015

Sci Rep

View full text Add to dashboard Cite

We demonstrate that cold and hot isostatic pressing (CIP and HIP) is a novel, alternative method for organic semiconductor layer fabrication, where organic powder is compressed into a layer shape directly on a substrate with 200 MPa pressure. Spatial gaps between powder particles and the other particles, substrates, or electrodes are crushed after CIP and HIP, making it possible to operate organic field-effect transistors (OFETs) containing the compressed powder as the semiconductor. The CIP-compressed powder of 2,7-dioctyl[1]benzothieno[3,2-b][1]benzothiophene (C8-BTBT) had a hole mobility of (1.6 ± 0.4) × 10–2 cm2/Vs. HIP of C8-BTBT powder increased the hole mobility to an amorphous silicon-like value (0.22 ± 0.07 cm2/Vs) because of the growth of the C8-BTBT crystallites and the improved continuity between the powder particles. The vacuum and solution processes are not involved in our CIP and HIP techniques, offering a possibility of manufacturing OFETs at low cost.

show abstract

mentioning

confidence: 99%

Vacuum-and-solvent-free fabrication of organic semiconductor layers for field-effect transistors

Matsushima

Sandanayaka

Esaki

et al. 2015

Sci Rep

View full text Add to dashboard Cite

show abstract

“…Saat ini, FEA telah diimplementasikan untuk simulasi proses cold isostatic pressing [12,13]. Kesulitan utama dalam menggunakan FEM untuk simulasi isostatic pressing bergantung pada model konstitutif strain finite kompleks dan perlakuan numeriknya serta parameter spesifik material yang harus ditentukan melalui eksperimen [14].…”

Section: Finite Element Analysis (Fea)unclassified

Prediksi Sifat Material Pressure Transmiting Medium Pada Quasi-Isostatic Pressing Menggunakan Finite Element Analysis

Sutarya

Pamungkas²,

Sukma³

et al. 2018

urania

View full text Add to dashboard Cite

PREDIKSI SIFAT MATERIAL PRESSURE TRANSMITTING MEDIUM PADA QUASI-ISOSTATIC PRESSING MENGGUNAKAN FINITE ELEMENT ANALYSIS. Teknik quasi-isostatik pressing merupakan pengembangan dari isostatic pressing yang dibuat lebih sederhana dan efisien. Quasi-isostatic pressing mampu memberikan efek penekanan triaxial volumetrik sehingga dapat menghasilkan produk dengan densitas yang seragam. Dengan keunggulan tersebut, maka teknik quasi-isostatic pressing digunakan dalam proses fabrikasi bahan bakar bola (pebble fuel) untuk high temperature gas cooled reactor (HTGR). Masalah utama penggunaan teknik quasi-isostatic pressing terletak pada material hiper-elastis sebagai pressure transmitting medium (PTM) untuk mentranser tekanan statis yang seragam ke segala arah pada proses kompaksi. Oleh karena itu, sifat dan karakteristik material PTM yang dibutuhkan untuk quasi-isotatic pressing dengan kondisi batasan proses yang diinginkan harus ditentukan. Pada penelitian ini digunakan Finite Element Analysis (FEA) untuk mempredisksi sifat dan karakteristik (konstanta) material PTM untuk proses quasi-isostatic pressing dengan menggunakan model Mooney-Rivlin 2 dan 3 parameter dan metode single-acting press. Hasil pengukuran FEA diperoleh nilai C10 sebesar 120 MPa, C01 sebesar 49 MPa dan C11 sebesar 10 Mpa, namun demikian,proses quasi-isostatic pressing pada kompaksi serbuk grafit masih belum terjadi secara sempurna. Penelitian lebih lanjut akan dilakukan dengan perbaikan secara numerik dan penggunaan model Mooney-Rivlin 5 hingga 9 parameter menggunakan metode double-acting press.Kata kunci:Quasi-isostatic pressing, pebble fuel, Mooney-Rivlin, pressure transmitting medium, finite element analysis.

show abstract

“…The continuum approach can describe the macroscopic densification behaviors but can't represent the detailed microscopic information such as the particle deformation, displacement path, and inter-particle frictional interactions. Two continuous models are available in the previous studies which are the micromechanical model [7,8] and phenomenological model [9,10]. The micromechanical model is based on mechanical behavior at particle-particle contacts.…”

Section: Introductionmentioning

confidence: 99%

Study the densification behavior and cold compaction mechanisms of solid particles-based powder and spongy particles-based powder using a multi-particle finite element method

Korim

2020

Mater. Res. Express

View full text Add to dashboard Cite

Powders could be based on solid particles or spongy particles depending on the powder manufacturing procedures. In this article, the numerical study of the cold compaction process for copper solid particles-based powder (i.e. Cu solid powder) and spongy particles-based powder (i.e. Cu sponge powder) has been carried out by using a two-dimensional multi-particle finite element method (2D-MPFEM) based on single action die compaction. The effects of internal pores content, external pressure, initial packing structure on the packing densification were systematically presented. Relative density, stress distribution, internal pore deformations, and force chain movements, particle rearrangement, and interfacial behavior within spongy particles were characterized and analyzed. The results reveal that the densification behavior of the sponge powder depends basically on the internal pore's content. Moreover, at low and medium relative density (ρ <0.95), the densification behavior of the sponge powder is faster than solid particles-based powder. However, at higher relative density near unity, the force required to cause further compaction is significantly larger in the sponge powder. In addition, from the microscopic analysis, the deformation behavior of the particles and the internal pores and the force chain development rely mostly on the structure configuration, internal pore content and its position.Recently, powder metallurgy (PM) becomes an appealing process technology for both advanced and traditional materials [1]. The PM technique is competitive with conventional metallurgical manufacturing methods such as casting, forging, and machining. Moreover, it has distinctive merits such as high production rate and near-netshape forming for complex geometrical shapes, special metals, alloys with high melting points, and porous structures. In addition, it can be considered cost-effective, materials saving, easy operation, and environmentfriendly mechanism [2]. Thus, PM techniques have a lot of applications that can be used in the areas of materials, marine industries, aeronautics, astronautics, and automotive parts [3]. Powder cold compaction is one of the major stages of PM production processes that plays a key role. Through the compaction, loose powders are compressed into a cohesive and dense state using tools such as compression punches and dies [4]. The powder compact structure resulting from the powder cold compaction affects the sintering process and the properties of the final product. Therefore, any optimization of the powder compaction process requires a deep understanding of the relations between the influential factors and the densification behaviors during the powder compaction process. Consequently, a large variety of physical and numerical studies have been carried out in this regard.It is very complicated for physical experiments to characterize parameters and properties of the green compacts such as the evolution of stress distribution and local relative density and plasticity and elasticity phenomena [5]. ...

show abstract

Experimental based finite element simulation of cold isostatic pressing of metal powders

Cited by 18 publications

References 16 publications

Vacuum-and-solvent-free fabrication of organic semiconductor layers for field-effect transistors

Vacuum-and-solvent-free fabrication of organic semiconductor layers for field-effect transistors

Prediksi Sifat Material Pressure Transmiting Medium Pada Quasi-Isostatic Pressing Menggunakan Finite Element Analysis

Study the densification behavior and cold compaction mechanisms of solid particles-based powder and spongy particles-based powder using a multi-particle finite element method

Contact Info

Product

Resources

About