Experimental and theoretical study of parasitic leakage/resonance in a K/Ka-band MMIC package

Yook, Jong-Gwan; Katehi, L.P.B.; Simons, Rainee N.; Shalkhauser, Kurt A.

doi:10.1109/22.554569

Cited by 13 publications

(1 citation statement)

References 8 publications

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“…In the previous papers [6][7][8][9], this phenomenon was well analyzed and the causes were identified and design rules or various methods for suppressing them were presented. For example, the resistivity [6] of the flip chip carrier, the resonance condition of the cavity [7], the chip mounting design rule [8], and the resistance coating of the lid [10] were investigated. Several modules [1,2,6,11] have been successfully developed to reflect these attempts.…”

Section: Introductionmentioning

confidence: 99%

High-Gain Amplifier Module Integrating a Waveguide into the Module Case for Millimeter Wave Applications

Lee¹

2018

Emerging Waveguide Technology

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A high-gain amplifier module with integrated waveguide (WG) has been presented for millimeter wave applications. In order to improve the isolation between the amplification stages in the multi-stage amplifier module, an isolated WG is integrated into the module case. It is possible to effectively suppress the oscillation occurring in the high gain stage. Microstrip line (MSL)-to-WG transitions are designed and fabricated on a 5 mil thick RT5880 substrate for interconnection of the isolated WG, input/output WG and amplifier PCB in a cascaded two-stage high gain amplifier module. The transition loss of −0.44 dB is obtained at 40 GHz and return-loss (S 11) bandwidth below −10 dB is from 34.1 to 50 GHz. The fabricated high-gain amplifier module shows a high gain over 39.7 dB from 38 to 41 GHz. At 38.7 GHz, its maximum gain of 44.25 dB is achieved.

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Section: Introductionmentioning

confidence: 99%

High-Gain Amplifier Module Integrating a Waveguide into the Module Case for Millimeter Wave Applications

Lee¹

2018

Emerging Waveguide Technology

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Development of multilayer liquid crystal polymer Ka‐band downconverter modules

Aihara

Zhang

Pham

et al. 2008

Micro & Optical Tech Letters

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A Ka‐band downconverter module is developed using liquid crystal polymer (LCP) thin‐film surface mount packages. The package utilizes vias to connect the RF input from the PCB signal launch onto the package substrate. The use of an LCP enclosure provides excellent moisture resistance in a compact structure. The multichip package has a measured loss of 0.4 dB at Ka‐band. © 2008 Wiley Periodicals, Inc. Microwave Opt Technol Lett 51: 364–367, 2009; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.24051

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Silicon Based On-Wafer and Discrete Packaging

Henderson

Katehi

1997

Directions for the Next Generation of MMIC Devices and Systems

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Experimental and theoretical study of parasitic leakage/resonance in a K/Ka-band MMIC package

Cited by 13 publications

References 8 publications

High-Gain Amplifier Module Integrating a Waveguide into the Module Case for Millimeter Wave Applications

High-Gain Amplifier Module Integrating a Waveguide into the Module Case for Millimeter Wave Applications

Development of multilayer liquid crystal polymer Ka‐band downconverter modules

Silicon Based On-Wafer and Discrete Packaging

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