Development of multilayer liquid crystal polymer Ka‐band downconverter modules

Abstract

A Ka‐band downconverter module is developed using liquid crystal polymer (LCP) thin‐film surface mount packages. The package utilizes vias to connect the RF input from the PCB signal launch onto the package substrate. The use of an LCP enclosure provides excellent moisture resistance in a compact structure. The multichip package has a measured loss of 0.4 dB at Ka‐band. © 2008 Wiley Periodicals, Inc. Microwave Opt Technol Lett 51: 364–367, 2009; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.24051